4,4-Dimethylhex-2-enoic acid | 1359767-09-1

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: 4,4-Dimethylhex-2-enoic acid
• 英文别名: (E)-4,4-dimethylhex-2-enoic acid
• CAS: 1359767-09-1
• 化学式: C₈H₁₄O₂
• 分子量: 142.198
• InChiKey: IBTARNALMVBJSI-AATRIKPKSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.5
• 重原子数：
  10
• 可旋转键数：
  3
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.62
• 拓扑面积：
  37.3
• 氢给体数：
  1
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  4,4-Dimethylhex-2-enoic acid 在 氯化亚砜 、 氨 、 二异丁基氢化铝 作用下， 以 水 、 甲苯 为溶剂， 反应 39.5h， 生成
  参考文献：
  名称：

  Novel (S)-1,2,3,4-tetrahydroisoquinoline-3-carboxylic acids: Peroxisome proliferator-activated receptor γ selective agonists with protein-tyrosine phosphatase 1B inhibition

  摘要：

  A novel series of 1,2,3,4-tetrahydroisoquinoline-3-carboxylic acid derivatives were synthesized and (S)-2-[(2E,4E)- hexadienoyl]-7-(2-(5-methyl-2-[( 1E)-5-methylhexen-1-yl]oxazol-4-yl]ethoxy)-1,2,3,4-tetrahydroisoquinoline-3-carboxylic acid (14i) was identified as a potent human peroxisome proliferator-activated receptor gamma (PPAR gamma) selective agonist (EC(50) = 0.03 mu M) and human protein-tyrosine phosphatase 1B (PTP-1B) inhibitor (IC(50) = 1.18 mu M). C(max) after oral administration of 14i at 10 mg/kg was 2.2 mu g/ml (4.5 mu M) in male SD rats. Repeated administration of 14i and rosiglitazone for 14 days dose-dependently decreased plasma glucose levels, ED(50) = 4.3 and 23 mg/kg/day, respectively, in male KK-A(y) mice. In female SD rats, repeated administration of 14i at 12.5-100 mg/kg/day for 28 days had no effect on the hematocrit value (Ht) and red blood cell count (RBC), while rosiglitazone significantly decreased them from 25 mg/kg/day. In conclusion, 14i showed about a fivefold stronger hypoglycemic effect and fourfold or more weaker hemodilution effect than rosiglitazone, indicating that 14i is 20-fold or more safer than rosiglitazone. Compound 14i is a promising candidate for an efficacious and safe anti-diabetic drug targeting PPAR gamma and PTP-1B. (C) 2011 Elsevier Ltd. All rights reserved.

  DOI：

  10.1016/j.bmc.2011.11.035

文献信息

• Polymers having stable anhydride rings
  申请人：SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V.

  公开号：EP0569100A1

  公开（公告）日：1993-11-10

  Polymers comprising anionically polymerized monomers such as butadiene or styrene and adjacent units of (1-methyl-1-alkyl)alkyl esters such as t-butylmethacrylate, as well as selectively hydrogenated derivatives thereof, are heated to at least 180 °C to convert the adjacent ester units to stable anhydride rings.

  由丁二烯或苯乙烯等阴离子聚合单体和甲基丙烯酸叔丁酯等(1-甲基-1-烷基)烷基酯的相邻单元及其选择性氢化衍生物组成的聚合物，加热至至少 180 °C，将相邻酯单元转化为稳定的酸酐环。
• Modified block copolymers and process for the preparation thereof
  申请人：SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V.

  公开号：EP0603965A2

  公开（公告）日：1994-06-29

  The modified block copolymers can be prepared by heating the anionically polymerized base block copolymers to a temperature between 170 and 260 °C in the presence of a primary or secondary amine to convert the polymerized ester to amide and imide groups.

  改性嵌段共聚物的制备方法是：在伯胺或仲胺存在下，将阴离子聚合的基质嵌段共聚物加热到 170 至 260 °C 的温度，使聚合酯转化为酰胺基和亚胺基。
• Novel copolymer, photoresist compositions thereof and deep UV bilayer system thereof
  申请人：ARCH SPECIALTY CHEMICALS, INC.

  公开号：US20040137362A1

  公开（公告）日：2004-07-15

  Novel copolymers suitable for forming the top layer photoimagable coating in a deep UV, particularly a 193 nm and 248 nm, bilayer resist system providing high resolution photolithography. Chemically amplified photoresist composition and organosilicon moieties suitable for use in the binder resin for photoimagable etching resistant photoresist composition that is suitable as a material for use in ArF and KrF photolithography using the novel copolymers.

  适用于在深紫外（尤其是 193 纳米和 248 纳米）双层抗蚀剂体系中形成顶层光致抗蚀涂层的新型共聚物，可提供高分辨率光刻技术。适用于粘合剂树脂中的化学放大光刻胶组合物和有机硅分子，该粘合剂树脂适用于使用新型共聚物的 ArF 和 KrF 光刻技术。
• POLYKETIDES, THEIR PREPARATION, AND MATERIALS FOR USE THEREIN
  申请人：Biotica Technology Limited

  公开号：EP1095147A2

  公开（公告）日：2001-05-02
• NOVEL COPOLYMER, PHOTORESIST COMPOSITIONS THEREOF AND DEEP UV BILAYER SYSTEM THEREOF
  申请人：Fujifilm Electronic Materials USA, Inc.

  公开号：EP1558654A2

  公开（公告）日：2005-08-03