申请人:DOW CORNING CORPORATION
公开号:EP1179569A2
公开(公告)日:2002-02-13
A silicone composition for preparing a cured silicone product, the composition prepared by mixing: (A) an organopolysiloxane containing an average of at least two epoxy-functional organic groups per molecule; (B) a curing agent in an amount sufficient to cure the composition, provided the curing agent is free of phenolic hydroxy groups; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone product, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition. A cured silicone product and a multi-part silicone composition.
一种用于制备固化硅树脂产品的硅树脂组合物,该组合物通过混合以下物质制备:(A) 有机聚硅氧烷,平均每个分子含有至少两个环氧官能有机基团;(B) 一种固化剂,其用量足以固化该组合物,条件是该固化剂不含酚羟基;(C) 一种导电填料,其用量足以使硅胶产品具有导电性,其中该填料包括至少具有选自银、金、铂、钯及其合金的金属外表面的颗粒;(D) 有效量的羟基官能团有机化合物,其分子量不超过约 1000,且每个分子至少含有一个羟基,条件是该化合物不会严重抑制组合物的固化。一种固化硅树脂产品和一种多组分硅树脂组合物。