摘要:
Photoresist underlayer compositions, comprising: a curable compound comprising a group of the following formula (1):
wherein: R
1
is each independently H, C
1-30
alkyl, or C
3-30
cycloalkyl; Ar
1
is an aromatic ring or a fused aromatic ring system having from 5 to 30 carbon atoms, wherein Ar
1
is substituted or unsubstituted; Ar
2
is an aromatic ring chosen from a 6-membered carbocyclic aromatic ring, a 5- or 6-membered heteroaromatic ring, or a fused aromatic ring system having from 5 to 30 carbon atoms, wherein Ar
2
optionally comprises a fused cyclic imide moiety, a fused oxazole moiety, a fused imidazole moiety, or a fused thiazole moiety, and wherein Ar
2
is substituted or unsubstituted; Y
1
is a single covalent bond, or is selected from —O—, —C(O)—, —C(O)O—, —S—, —S(O)
2
—, —N(R
2
)—, —C(O)N(R
2
)—, —C(O)N(R
2
)C(O)—, —(CH
2
)
y
—, or a combination thereof, wherein R
2
is H, C
1-10
alkyl, C
2-10
unsaturated hydrocarbyl, C
5-30
aryl, C(O)R
3
, or S(O)
2
R
3
, wherein R
3
is chosen from H, C
1-10
alkyl, C
2-10
unsaturated hydrocarbyl, and C
5-30
aryl, and y is an integer from 1 to 6; x is an integer from 2 to 5; and * denotes a binding site to a part of the curable compound other than the group represented by formula (1), provided that no two
groups are in an ortho position to each other on Ar
1
, wherein ** denotes the point of attachment to an aromatic ring carbon of Ar
1
; and
a solvent.