Naphthalin-tetracarbonsaeure(1.2.5.8) | 92103-90-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 菲及其衍生物
• 英文名称: Naphthalin-tetracarbonsaeure(1.2.5.8)
• 英文别名: Naphthalene-1,2,5,8-tetracarboxylic acid
• CAS: 92103-90-7
• 化学式: C₁₄H₈O₈
• 分子量: 304.213
• InChiKey: HDLRSIQOZFLEPK-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.3
• 重原子数：
  22
• 可旋转键数：
  4
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  149
• 氢给体数：
  4
• 氢受体数：
  8

文献信息

• CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD OF MANUFACTURING PLATED ARTICLE, AND MERCAPTO COMPOUND
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US20190121233A1

  公开（公告）日：2019-04-25

  A chemically amplified positive-type photosensitive resin composition capable of suppressing the occurrence of “footing” in which the width of the bottom (the side proximal to the surface of a support) becomes narrower than that of the top (the side proximal to the surface of a resist layer) in the nonresist portion; and the generation of development residue when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate using the photosensitive resin composition. A mercapto compound having a specific structure is included in the photosensitive resin composition, and includes an acid generator which generates acid upon exposure to an irradiated active ray or radiation, and a resin whose solubility in alkali increases under the action of acid.

  一种化学增感型正型光敏树脂组合物，能够抑制“足部”现象的发生，即底部（靠近支撑表面的一侧）的宽度变窄，小于顶部（靠近抗蚀层表面的一侧）的宽度，同时在使用该光敏树脂组合物在基板的金属表面上形成用作电镀物品模板的抗蚀图案时，能够减少残留物的产生。该光敏树脂组合物中包含一种具有特定结构的巯基化合物，其中包括一个酸发生剂，该酸发生剂在暴露于辐射活性光线或辐射时产生酸，以及一种树脂，在酸的作用下其在碱性溶液中的溶解度增加。
• CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD OF MANUFACTURING PLATED ARTICLE, AND COMPOUND
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US20200209739A1

  公开（公告）日：2020-07-02

  A chemically amplified photosensitive composition which forms a resist pattern whose cross-sectional shape is rectangular, and which has a wide depth of focus margin; a photosensitive dry film having a photosensitive layer made from the composition; a method of manufacturing a patterned-resist film using the composition; a method of manufacturing a substrate with a template using the composition; a method of manufacturing a plated article using the substrate with a template; and a novel compound. An acid diffusion suppressing agent having a specific structure is blended into the composition including an acid generator which generates acid upon exposure to an irradiated active ray or radiation.

  一种化学增感光敏组合物，形成一个截面形状为矩形的抗蚀图案，具有宽广的焦深度余量；一种具有由该组合物制成的感光层的感光干膜；使用该组合物制造图案抗蚀膜的方法；使用该组合物制造带有模板的基板的方法；使用带有模板的基板制造电镀物品的方法；以及一种新型化合物。酸扩散抑制剂与包括在暴露于辐射活性光线或辐射时生成酸的酸发生剂的组合物中混合，具有特定的结构。
• Radiation-sensitive resin composition
  申请人：——

  公开号：US20040142280A1

  公开（公告）日：2004-07-22

  A radiation-sensitive resin composition comprising (A) an alkali-soluble resin having an unsaturated group, (B) a compound having at least one ethylenically unsaturated double bond, and (C) a radiation-induced radical polymerization initiator, wherein: the alkali-soluble resin having an unsaturated group (A) is obtained by reacting: 100 parts by weight of a copolymer comprising 1 to 40 wt % structural units derived from (a) a radically polymerizable compound having a carboxyl group; 1 to 50 wt % structural units having a phenolic hydroxyl group which are derived from (b-1) a radically polymerizable compound having a phenolic hydroxyl group or (b-2) a radically polymerizable compound having a functional group convertible into a phenolic hydroxyl group after the copolymerization, other structural units of said copolymer being derived from (c) another radically polymerizable compound; with 0.1 to 20 parts by weight of (d) a radically polymerizable compound having an epoxy group. The resin composition can form a radiation-sensitive film in a thickness greater than a deposit thickness and has a high resolution.

  一种辐射敏感的树脂组合物，包括（A）具有不饱和基团的碱溶性树脂，（B）至少具有一个乙烯基不饱和双键的化合物，和（C）辐射诱导的自由基聚合引发剂，其中：具有不饱和基团的碱溶性树脂（A）是通过反应得到的：100重量份的共聚物，包括1至40重量％的由（a）具有羧基的自由基聚合化合物衍生的结构单元，1至50重量％的具有酚羟基的结构单元，该结构单元来源于（b-1）具有酚羟基的自由基聚合化合物或（b-2）在共聚之后可以转化为酚羟基的功能性基团的自由基聚合化合物，该共聚物的其他结构单元来源于（c）另一种自由基聚合化合物；以及0.1至20重量份的具有环氧基团的自由基聚合化合物（d）。该树脂组合物可以形成具有高分辨率的辐射敏感薄膜，其厚度大于沉积厚度。
• [EN] CURABLE RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, SEMICONDUCTOR DEVICE, AND PHOTOBASE GENERATOR<br/>[FR] COMPOSITION DE RÉSINE DURCISSABLE, OBJET DURCI AINSI QUE PROCÉDÉ DE FABRICATION DE CELUI-CI, STRATIFIÉ, DISPOSITIF À SEMI-CONDUCTEURS, ET GÉNÉRATEUR DE PHOTOBASE<br/>[JA] 硬化性樹脂組成物、硬化物、積層体、硬化物の製造方法、及び、半導体デバイス、並びに、光塩基発生剤
  申请人：FUJIFILM CORP

  公开号：WO2022050278A1

  公开（公告）日：2022-03-10

  ポリイミド前駆体、ポリベンゾオキサゾール前駆体及びポリアミドイミド前駆体よりなる群から選ばれた少なくとも１種の樹脂、及び、アルコキシシリル基を有する光塩基発生剤を含む、硬化性樹脂組成物、上記硬化性樹脂組成物を硬化してなる硬化物、上記硬化物を含む積層体、上記硬化物の製造方法、及び、上記硬化物又は上記積層体を含む半導体デバイス、並びに、光塩基発生剤。

  选择至少一种由聚酰亚胺前体、聚苯并噁嗪前体和聚酰亚胺咪唑前体组成的树脂，以及含有烷氧基硅基的光碱发生剂的硬化树脂组合物，通过硬化上述硬化树脂组合物得到的硬化物，包含上述硬化物的层压体，制造上述硬化物的方法，以及包含上述硬化物或上述层压体的半导体器件，以及光碱发生剂。
• Epoxy resin compositions as used in producing composites with high wet glass transition temperatures and in adhesive applications
  申请人：HERCULES INCORPORATED

  公开号：EP0319008A2

  公开（公告）日：1989-06-07

  Thermosetting epoxy resin compositions, comprising a polyfunctional epoxy resins, dianhydride or diamine hardeners, and amide, imide, or amideimide oligomers,and their uses in making adhesives, or thermoset composites that exhibit a critical stress intensity factor (K1C) greater than 1.0 MPam½ while maintaining a wet Tg greater than about 120°C upon curing in the presence of inorganic or organic fibers, are described; the oligomers are terminated with amine, isocyanate or carboxylic acid derivative groups, have a number average moleculer weight from about 1000 to about 50,000 and a glass transition temperature of above about 150°C, while being soluble in the combination of the epoxy resin and the hardener at a temperature under about 150° C.

  本发明描述了由多官能团环氧树脂、二酸酐或二胺固化剂以及酰胺、亚胺或酰胺亚胺低聚物组成的热固性环氧树脂组合物及其在制造粘合剂或热固性复合材料中的用途，该组合物在无机或有机纤维存在下固化时，临界应力强度因子（K1C）大于1.0 MPam½，同时在无机或有机纤维存在下固化时保持大于约 120°C 的湿 Tg；所述低聚物以胺、异氰酸酯或羧酸衍生物基团为端基，具有约 1000 至约 50,000 的平均分子量和高于约 150°C 的玻璃化转变温度，同时在低于约 150°C 的温度下可溶于环氧树脂和固化剂的组合中。