申请人:DAICEL CORPORATION
公开号:US20190119489A1
公开(公告)日:2019-04-25
Provided is a thermosetting compound that has satisfactory solvent solubility and can be rapidly cured by a heat treatment to form a cured product having extreme heat resistance. The thermosetting compound according to the present invention is represented by following Formula (1). In Formula (1), R
1
and R
2
each independently represent a thermosetting group; D
1
and D
2
are each, identically or differently, selected from a single bond and a linkage group; Ar
1
, Ar
2
, and Ar
3
are each, identically or differently, selected from a divalent aromatic hydrocarbon group and a divalent group including two or more aromatic hydrocarbons bonded to each other via any one selected from a single bond, a divalent aliphatic hydrocarbon group, and a divalent alicyclic hydrocarbon group; and E represents, independently on each occurrence, an ester bond.