The polyimide film of this invention is formed from a polyimide, which is prepared by reacting a diamino compound represented by the general formula (1):
wherein X represents a hydrocarbon group having 1 to 20 carbon atoms or a sulfur atom; R represents each independently a halogen atom, a hydrocarbon group having 1 to 6 carbon atoms or a halogen-containing hydrocarbon group having 1 to 6 carbon atoms; a represents each independently an integer of 0 to 4;
with a tetracarboxylic dianhydride represented by the general formula (2)
wherein Y represents a tetravalent organic group having 2 or more carbon atoms.
The polyimide film obtained can be applied favorably to a flexible printed circuit board without adhesion layer, a protective coating for electronic parts and electric wires, or a heat resistant adhesive.
本发明的聚
酰亚胺薄膜由聚
酰亚胺制成,聚
酰亚胺是由通式 (1) 所代表的二
氨基化合物经反应制备而成:
其中 X 代表具有 1 至 20 个碳原子的烃基或
硫原子;R 独立地分别代表卤素原子、具有 1 至 6 个碳原子的烃基或具有 1 至 6 个碳原子的含卤烃基;a 独立地分别代表 0 至 4 的整数;
与通式 (2) 所代表的四
羧酸二酐反应
其中 Y 代表具有 2 个或更多碳原子的四价有机基团。
获得的聚
酰亚胺薄膜可用于无粘合层的柔性印刷电路板、电子零件和电线的保护涂层或耐热粘合剂。