Nonanedioic acid--ammonia (1/2) | 63075-84-3

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: Nonanedioic acid--ammonia (1/2)
• 英文别名: azane;nonanedioic acid
• CAS: 63075-84-3
• 化学式: C9H22N2O4
• 分子量: 222.28
• InChiKey: ORKKMKUDEPWHTG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -0.03
• 重原子数：
  15
• 可旋转键数：
  6
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.78
• 拓扑面积：
  82.3
• 氢给体数：
  2
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  Nonanedioic acid--ammonia (1/2) 以4%的产率得到
  参考文献：
  名称：

  ZHAROV, A. A.;CHISTOTINA, N. P., DOKL. AN CCCP, 306,(1989) N, S. 650-654

  摘要：

  DOI：

文献信息

• An ionic conductive polymer electrolyte
  申请人：MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

  公开号：EP0579921A1

  公开（公告）日：1994-01-26

  An ionic conductive polymer electrolyte including a polymer having ether type oxygen in the structure and a plasticizer is provided. The plasticizer is at least one selected from the group consisting of compounds represented by the following general Formulas I, II, III, IV and V: Formula I:   HO - (C₂H₄O)n - H wherein n is 2, 3, 4 or 5; Formula II:   RO - (C₂H₄O)n - H wherein R is CH₃, C₂H₅, C₃H₇ or C₄H₉; and n is 3, 4 or 5;         Formula III:   R₁O - (C₂H₄O)n - R₂ wherein R₁=R₂=CH₃, and n is 4, 5 or 6; or R₁=R₂=C₂H₅, and n is 4, 5 or 6; or R₁=R₂=C₃H₇, and n is 3, 4, 5 or 6; or R₁=R₂=C₄H₉, and n is 2, 3, 4 or 5; or R₁= CH₃, R₂=C₄H₉, and n is 4, 5 or 6;         Formula IV:   R₁O - (C₂H₄O)n - (C₃H₆O)m - H wherein n+m is 2, 3, 4 or 5, and R₁ = CH₃, C₂H₅, C₃H₇ or C₄H₉; and         Formula V:   R₁O - (C₂H₄O)n - (C₃H₆O)m - R₂ wherein n+m is 2, 3, 4, or 5 and R₁=R₂=CH₃.

  本发明提供了一种离子导电聚合物电解质，包括一种结构中含有醚型氧的聚合物和一种增塑剂。增塑剂至少选自由以下通式 I、II、III、IV 和 V 所代表的化合物组成的组： 式 I：HO - (C₂H₄O)n - H 其中 n 为 2、3、4 或 5； 式 II：RO - (C₂H₄O)n - H 其中 R 是 CH₃、C₂H₅、C₃H₇ 或 C₄H₉；n 是 3、4 或 5； 式 III: R₁O - (C₂H₄O)n - R₂ 其中 R₁=R₂=CH₃, n 为 4、5 或 6；或 R₁=R₂=C₂H₅, n 为 4、5 或 6；或 R₁=R₂=C₃H₇, n 为 3、4、5 或 6；或 R₁=R₂=C₄H₉, n 为 2、3、4 或 5；或 R₁= CH₃, R₂=C₄H₉, n 为 4、5 或 6； 式 IV：R₁O - (C₂H₄O)n - (C₃H₆O)m - H 其中 n+m 为 2、3、4 或 5，且 R₁ = CH₃、C₂H₅、C₃H₇ 或 C₄H₉；以及 式 V： R₁O - (C₂H₄O)n - (C₃H₆O)m - R₂ 其中 n+m 为 2、3、4 或 5，R₁=R₂=CH₃。
• Electrically conductive polymer composition
  申请人：DAI-ICHI KOGYO SEIYAKU CO., LTD.

  公开号：EP0596148A1

  公开（公告）日：1994-05-11

  The electrically conductive polymer composition of this invention comprises (A) a polyaniline, (B) at least one member selected from the class consisting of homopolymers, block copolymers and random copolymers of alkylene oxide monomers and crosslinking products thereof, and (C) at least one member selected from the class consisting of protonic acid anions, electron acceptors, alkali metal salts and alkaline earth metal salts. This composition affords a choice of electronic conductance or ionic conductance, or both, according to the intended application. Furthermore, since it is highly processable and flexible, the composition finds application in a variety of uses.

  本发明的导电聚合物组合物包括：(A) 聚苯胺；(B) 至少一种选自环氧烷单体的均聚物、嵌段共聚物和无规共聚物及其交联产物；(C) 至少一种选自质子酸阴离子、电子受体、碱金属盐和碱土金属盐。这种成分可根据预期应用选择电子导电性或离子导电性，或两者兼而有之。此外，由于该组合物具有高度的可加工性和灵活性，因此可用于多种用途。
• Cleaning liquid for producing semiconductor device and process for producing semiconductor device using same
  申请人：MITSUBISHI GAS CHEMICAL COMPANY, INC.

  公开号：EP0827188A2

  公开（公告）日：1998-03-04

  There is disclosed a cleaning liquid for producing a semiconductor device which comprises (A) fluorine-containing compound; (B) water-soluble or water-miscible organic solvent; and (C) inorganic acid and/or organic acid, optionally, further comprises (D) quaternary ammonium salt or (D') a specific organic carboxylic acid ammonium salt and/or an organic carboxylic acid amine salt; as well as a process for producing a semiconductor device by forming a resist pattern on a substrate equipped on the surface with an insulating film layer or a metallic electroconductive layer, forming a via hole or electric wiring by dry etching, removing the resist pattern by ashing treatment with oxygen plasma; and effecting an cleaning treatment with the above cleaning liquid. The above cleaning liquid and production process can readily remove the deposit polymer formed in the case of dry etching without impairing metallic film and insulating film.

  本发明公开了一种用于生产半导体器件的清洗液，其包括(A)含氟化合物；(B)水溶性或水混溶性有机溶剂；以及(C)无机酸和/或有机酸，可选地，还包括(D)季铵盐或(D')特定有机羧酸铵盐和/或有机羧酸胺盐；以及一种半导体器件的生产工艺，在表面装有绝缘膜层或金属导电层的基片上形成抗蚀图案，通过干法蚀刻形成通孔或电线，通过氧等离子体灰化处理去除抗蚀图案，并用上述清洗液进行清洗处理。上述清洗液和生产工艺可轻松去除干法蚀刻时形成的沉积聚合物，而不会损害金属膜和绝缘膜。
• POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE OBTAINED BY MOLDING SAME
  申请人：Toray Industries, Inc.

  公开号：EP3998305A1

  公开（公告）日：2022-05-18

  A problem to be addressed by the present invention is to provide a polyamide resin composition that makes it possible to obtain a molded article having excellent fluidity, excellent prying strength, and excellent adhesivity with metal. The spirit of the present invention is a polyamide resin composition including 100 parts by mass of a polyamide resin (A) and 0.1 part by mass or more and 10 parts by mass or less of an ammonium salt (B) composed of a C6-12 aliphatic dicarboxylic acid and ammonia.

  本发明要解决的一个问题是提供一种聚酰胺树脂组合物，该组合物可以获得具有极佳流动性、极佳撬拔强度以及与金属极佳粘合性的模塑制品。本发明的精神是一种聚酰胺树脂组合物，包括 100 质量份的聚酰胺树脂（A）和 0.1 质量份或以上、10 质量份或以下的由 C6-12 脂肪族二羧酸和氨组成的铵盐（B）。
• Process for the separation of long chain amino acids and dibasic acids
  申请人：VITAWORKS IP, LLC

  公开号：US10239822B2

  公开（公告）日：2019-03-26

  There is disclosed a process for the separation of long chain dibasic acid and fatty acid, comprising: (1) reacting a mixture of long chain dibasic acid and fatty acid with ammonium hydroxide to form an insoluble ammonium salt of fatty acid and a soluble ammonium salt of long chain dibasic acid; (2) recovering the insoluble ammonium salt of fatty acid; and (3) adding an acid to the mother liquor of step (2) to obtain the long chain dibasic acid.

  本发明公开了一种分离长链二元酸和脂肪酸的工艺，包括：(1) 将长链二元酸和脂肪酸的混合物与氢氧化铵反应，生成脂肪酸的不溶性铵盐和长链二元酸的可溶性铵盐；(2) 回收脂肪酸的不溶性铵盐；(3) 向步骤(2)的母液中加入一种酸，得到长链二元酸。