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4-formylphenyl formate | 71298-06-1

中文名称
——
中文别名
——
英文名称
4-formylphenyl formate
英文别名
4-formoxybenzaldehyde;4-formyloxybenzaldehyde;(4-formylphenyl) formate
4-formylphenyl formate化学式
CAS
71298-06-1
化学式
C8H6O3
mdl
——
分子量
150.134
InChiKey
ITNVPNIQTLUFOP-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    1.6
  • 重原子数:
    11
  • 可旋转键数:
    3
  • 环数:
    1.0
  • sp3杂化的碳原子比例:
    0.0
  • 拓扑面积:
    43.4
  • 氢给体数:
    0
  • 氢受体数:
    3

上下游信息

  • 上游原料
    中文名称 英文名称 CAS号 化学式 分子量

反应信息

  • 作为产物:
    描述:
    对羟基苯甲醛N,N-二甲基甲酰胺草酰氯 作用下, 以 二氯甲烷 为溶剂, 反应 6.0h, 以80%的产率得到4-formylphenyl formate
    参考文献:
    名称:
    了解 N,N-二甲基甲酰胺和草酰氯组合作为化学选择性 O-甲酰化剂的功效:统一的实验和理论研究
    摘要:
    摘要 我们开发了一种简单但有效的合成方案,用于在二氯甲烷 (DCM) 中使用 N,N-二甲基甲酰胺 (DMF) 和草酰氯 [(COCl)2] 组合对各种芳香羟基/酚类底物进行 O-甲酰化在环境温度下作为溶剂。发现 DMF/(COCl)2 组合对芳香族/酚羟基的化学选择性高于脂肪族羟基或芳香胺/硫醇基团。基于实验和基于密度泛函理论的理论研究结果解释了 DMF/(COCl)2 组合对芳香醇 O-甲酰化的这种化学选择性。图形概要
    DOI:
    10.1080/00397911.2016.1168450
点击查看最新优质反应信息

文献信息

  • Preparation of amino acids from unsaturated hydantoins
    申请人:STAUFFER CHEMICAL COMPANY
    公开号:EP0177072A2
    公开(公告)日:1986-04-09
    Amino acids can be easily prepared by reducing unsaturated hydantoins to the corresponding saturated hydantoins by hydrogenating the unsaturated hydantoin using either Raney Nickel catalyst in the presence of more than a stoichiometric amount of caustic or by using zinc and hydrochloric acid followed by hydrolyzing the resultant composition with at least 3 molar equivalents of an alkali metal hydroxide to produce a racemate of an alpha amino acid. The amino acid in suitable derivative form can then be resolved particularly using a two-phase solvent system. The residual isomer of the amino acid remaining after the resolution process can then be racemized using either pyridoxal-5-phosphate or an aliphatic acid in combination with an aldehyde or a ketone. By these procedures, it is possible to obtain high yields of amino acids.
    通过使用雷尼镍催化剂在超过一定量的苛性碱存在下将不饱和海因氢化,或使用锌和盐酸将不饱和海因氢化,然后用至少 3 摩尔当量的碱金属氢氧化物水解所得到的组合物,生成α-氨基酸的外消旋体,从而将不饱和海因还原成相应的饱和海因,可以很容易地制备氨基酸。然后,以适当的衍生物形式存在的氨基酸可以通过两相溶剂系统进行溶解。然后,可使用吡哆醛-5-磷酸或脂肪族酸与醛或酮结合,对解析过程后残留的氨基酸异构体进行消旋化。通过这些程序,可以获得高产率的氨基酸。
  • Promotion of raney nickel catalyst
    申请人:STAUFFER CHEMICAL COMPANY
    公开号:EP0210683A1
    公开(公告)日:1987-02-04
    There is disclosed a number of processes for the promotion of the Raney Nickel catalyzed hydrogenation of carbon-carbon double bonds. (a) One process uses tertiary amines to promote the Raney Nickel catalyzed hydrogenation. (b) Another process uses acetylene and acetylene derivatives to promote the Raney Nickel catalyzed hydrogenation. The promotion of Raney Nickel catalyst is particularly suited for the reduction of unsaturated hydantoins to saturated hydantoins and also for the reduction of cyclic and acyclic olefins and diolefins to the corresponding cyclic and acyclic alkanes.
    已公开了一些促进拉尼镍催化碳碳双键氢化的工艺。 (a) 一种工艺使用叔胺促进拉尼镍催化氢化。 (b) 另一种工艺使用乙炔和乙炔衍生物促进拉尼镍催化氢化。 拉尼镍催化剂的促进作用特别适用于将不饱和海因还原为饱和海因,也适用于将环状和非环状烯烃和二烯烃还原为相应的环状和非环状烷烃。
  • Thiazole derivatives, their preparation and their use in the treatment of diabetes complications
    申请人:Sankyo Company Limited
    公开号:EP0337819A1
    公开(公告)日:1989-10-18
    Compounds of formula (I): in which: R1 and R2 are independently hydrogen, alkyl, aliphatic hydrocarbon groups having one or two carbon-carbon double or treble bonds, cycloalkyl, aryl, substituted aryl, aralkyl, substituted aralkyl, alkanoyl, alkenoyl, cycloalkylcarbonyl, arylcarbonyl, substituted arylcaronyl, arylalkanoyl, substituted arylalkanoyl, arylalkenoyl, substituted arylalkenoyl, alkoxycarbonyl, aryloxycarbonyl, substituted aryloxycarbonyl, aralkyloxycarbonyl, substituted aralkyloxycarbonyl, optionally substituted carbamoyl or thiocarbamoyl, alkylsulphonyl, haloalkylsulphonyl, arylsulphonyl, substituted arylsulphonyl, alkylthio, arylthio and substituted arylthio, or R1 and R2, together with the nitrogen atom to which they are attached, form a nitrogen-containing heterocyclic group; one of Ra and Rb is hydrogen, alkyl or halogen, and the other of Ra and Rb is a group of formula (II): R4 is hydrogen, carboxy, protected carboxy or optionally substituted carbamoyl; R5 is hydrogen, or carboxyalkyl or protected carboxyalkyl in which the alkyl part is C1 -Cs; n = 0, 1 or 2; X is oxygen or sulphur; are useful in the treatment of the complications attendant upon diabetes and may be prepared by condensation of a thiazolidine or rhodanine compound with a compound corresponding to the remainder of the molecule of the compound of formula (I).
    式(I)化合物: 其中 R1 和 R2 独立地为氢、烷基、具有一个或两个碳碳双键或三键的脂族烃基、环烷基、芳基、取代芳基、烷酰基、烯酰基、环烷基羰基、芳基羰基、取代芳基羰基、芳基烷酰基、取代芳基烷酰基、芳基烯酰基、取代芳基烯酰基、烷氧基羰基、芳氧基羰基、芳氧基羰基、芳烷氧基羰基、取代芳氧基羰基、芳烷氧基羰基、芳烷氧基羰基、取代芳烷氧基羰基、选择性取代氨基甲酰基或硫代氨基甲酰基、烷氧基羰基、芳氧基羰基、取代的芳氧基羰基、烷氧基羰基、取代的芳氧基羰基、任选取代的氨基甲酰基或硫代氨基甲酰基、烷基磺酰基、卤代烷基磺酰基、芳基磺酰基、取代的芳基磺酰基、烷硫基、芳硫基和取代的芳硫基,或 R1 和 R2 与它们所连接的氮原子一起形成含氮杂环基团;Ra 和 Rb 中的一个是氢、烷基或卤素,Ra 和 Rb 中的另一个是式 (II) 基团: R4 是氢、羧基、受保护的羧基或任选取代的氨基甲酰基;R5 是氢、羧基烷基或受保护的羧基烷基,其中烷基部分是 C1-Cs;n = 0、1 或 2;X 是氧或硫; 可通过噻唑烷或罗丹宁化合物与对应于式(I)化合物分子剩余部分的化合物缩合制备。
  • PROCESS FOR CHARGING A POLYMERIC PRODUCT WITH ATTRIBUTE IMPARTING AGENT(S)
    申请人:LODHA Preeti
    公开号:US20110166192A1
    公开(公告)日:2011-07-07
    The invention relates to a process for charging a polymeric product with attribute imparting agent(s) to the polymeric product prepared by the process and to a composition for preparing the polymeric product capable of retaining the acquired attributes for a long period of time.
  • EPOXY RESIN, EPOXY RESIN COMPOUND COMPRISING THE SAME, AND RADIANT HEAT CIRCUIT BOARD USING THE COMPOUND
    申请人:LG INNOTEK CO., LTD.
    公开号:US20130284502A1
    公开(公告)日:2013-10-31
    An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided.
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