A composition for a bond ply, and a circuit subassembly that comprises such bond ply, are disclosed. The circuit subassembly can have a UL-94 rating of V-0. The composition of the bond ply layer comprises 25 to 45 volume percent of liquid resin; 10 to 40 weight percent of a bromine-containing or phosphorus-containing aromatic compound having a peak melting point of at least about 260° C.; and 5 to 35 volume percent inorganic filler.
本文公开了一种用于粘合层的组合物以及包含这种粘合层的电路组件。电路组件的 UL-94 等级为 V-0。粘合层的组合物包括 25 至 45 体积百分比的液态
树脂;10 至 40 重量百分比的含
溴或含
磷芳香族化合物,其峰值熔点至少约为 260°C;以及 5 至 35 体积百分比的无机填料。