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2-hydroxy-2-methyl-heptanoic acid amide | 66461-74-3

中文名称
——
中文别名
——
英文名称
2-hydroxy-2-methyl-heptanoic acid amide
英文别名
2-Hydroxy-2-methyl-oenanthsaeure-amid;C-Methyl-C-pentyl-glykolsaeure-amid;2-Hydroxy-2-methyl-heptansaeure-amid;2-Hydroxy-2-methylheptanamide;2-hydroxy-2-methylheptanamide
2-hydroxy-2-methyl-heptanoic acid amide化学式
CAS
66461-74-3
化学式
C8H17NO2
mdl
——
分子量
159.228
InChiKey
VWVHPNOYUATBTA-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 沸点:
    295.0±23.0 °C(Predicted)
  • 密度:
    1.001±0.06 g/cm3(Predicted)

计算性质

  • 辛醇/水分配系数(LogP):
    1
  • 重原子数:
    11
  • 可旋转键数:
    5
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    0.88
  • 拓扑面积:
    63.3
  • 氢给体数:
    2
  • 氢受体数:
    2

反应信息

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文献信息

  • LOW-TEMPERATURE CURING ADHESIVE COMPOSITIONS
    申请人:PPG Industries Ohio, Inc.
    公开号:EP3580253B1
    公开(公告)日:2021-04-07
  • [EN] SURFACTANT COMPOSITIONS WITH ANTI-MICROBIAL EFFECT<br/>[FR] COMPOSITIONS TENSIOACTIVES A EFFET ANTI-MICROBIEN
    申请人:CASTROL LIMITED
    公开号:WO1996028458A1
    公开(公告)日:1996-09-19
    (EN) Surfactant compositions, of use to treat Gram negative bacteria, Gram positive spore-forming bacteria, filamentous fungi or yeasts, contain a sugar amine of formula (1), wherein A represents a monosaccharide, disaccharide, trisaccharide or higher polysaccharide group, wherein R1 and R2 each represents hydrogen or an optionally substituted alkyl or aryl group having from 1 to 24 C atoms and wherein the saccharide group directly attached to the amine group is of hydrogenated, ring-opened structure.(FR) Compositions tensioactives, utiles pour détruire les bactéries Gram-négatives, les bactéries sporulées Gram-positives, et les levures ou champignons filamenteux, contenant une amine de sucre de formule (1), dans laquelle A représente un monosaccharide, un disaccharide, un trisaccharide ou un groupe polysaccharide supérieur, et R1 et R2 représentent chacun l'hydrogène ou un groupe alkyle ou aryle éventuellement substitué comportant de 1 à 24 atomes de carbone, le groupe saccharide directement lié au groupe amine ayant une structure hydrogénée à ouverture de cycle.
  • [EN] LOW-TEMPERATURE CURING COATING COMPOSITIONS<br/>[FR] COMPOSITIONS DE REVÊTEMENT DURCISSANT À BASSE TEMPÉRATURE
    申请人:PPG IND OHIO INC
    公开号:WO2018148306A1
    公开(公告)日:2018-08-16
    The present invention is directed towards a coating composition comprising a film-forming polymer comprising active hydrogen-containing functional groups; a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester or thioester; and a curing catalyst that does not contain tin, lead, iron, zinc or manganese. Also disclosed are coatings, coated substrates, and methods of coating a substrate.
  • [EN] LOW-TEMPERATURE CURING ADHESIVE COMPOSITIONS<br/>[FR] COMPOSITIONS ADHÉSIVES DURCISSABLES À BASSE TEMPÉRATURE
    申请人:PPG IND OHIO INC
    公开号:WO2018148323A1
    公开(公告)日:2018-08-16
    Disclosed herein is an adhesive composition comprising: an epoxy-containing component; and a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester, or thioester, or a combination thereof. Also disclosed are methods for forming a bonded substrate with the adhesive composition. Also disclosed is an article comprising first and second substrates and the adhesive composition.
  • 5,5-Dialkyl-2,4-oxazolidinediones<sup>1,2</sup>
    作者:Roger W. Stoughton
    DOI:10.1021/ja01854a019
    日期:1941.9
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