2-hydroxy-2-methyl-caprylic acid amide | 66461-78-7

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: 2-hydroxy-2-methyl-caprylic acid amide
• 英文别名: Inaktive 2-Hydroxy-2-methyl-caprylsaeure-amid；2-Hydroxy-2-methyl-caprylsaeure-amid；2-Hydroxy-2-methyloctanamide
• CAS: 66461-78-7
• 化学式: C₉H₁₉NO₂
• 分子量: 173.255
• InChiKey: RZYHRAZQOJTUAY-UHFFFAOYSA-N

物化性质

• 沸点：
  309.9±25.0 °C(Predicted)
• 密度：
  0.987±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.6
• 重原子数：
  12
• 可旋转键数：
  6
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.89
• 拓扑面积：
  63.3
• 氢给体数：
  2
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  2-hydroxy-2-methyl-caprylic acid amide 在 sodium hydroxide 作用下， 生成 2-hydroxy-2-methyloctanoic acid
  参考文献：
  名称：

  5,5-Dialkyl-2,4-oxazolidinediones^1,2

  摘要：

  DOI：

  10.1021/ja01854a019
• 作为产物：
  描述：

  氢氰酸 、 2-甲基庚烷-1-醛 在 哌啶 作用下， 生成 2-hydroxy-2-methyl-caprylic acid amide
  参考文献：
  名称：

  5,5-Dialkyl-2,4-oxazolidinediones^1,2

  摘要：

  DOI：

  10.1021/ja01854a019

文献信息

• ANTIMICROBIAL COMPOSITIONS
  申请人：Wenk Hans Henning

  公开号：US20080145320A1

  公开（公告）日：2008-06-19

  Compounds of the general formula and to the use thereof for controlling microorganisms are provided.

  提供了通式化合物及其用于控制微生物的用途。
• LOW-TEMPERATURE CURING ADHESIVE COMPOSITIONS
  申请人：PPG Industries Ohio, Inc.

  公开号：EP3580253B1

  公开（公告）日：2021-04-07
• US7847123B2
  申请人：——

  公开号：US7847123B2

  公开（公告）日：2010-12-07
• [EN] LOW-TEMPERATURE CURING COATING COMPOSITIONS<br/>[FR] COMPOSITIONS DE REVÊTEMENT DURCISSANT À BASSE TEMPÉRATURE
  申请人：PPG IND OHIO INC

  公开号：WO2018148306A1

  公开（公告）日：2018-08-16

  The present invention is directed towards a coating composition comprising a film-forming polymer comprising active hydrogen-containing functional groups; a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester or thioester; and a curing catalyst that does not contain tin, lead, iron, zinc or manganese. Also disclosed are coatings, coated substrates, and methods of coating a substrate.
• [EN] LOW-TEMPERATURE CURING ADHESIVE COMPOSITIONS<br/>[FR] COMPOSITIONS ADHÉSIVES DURCISSABLES À BASSE TEMPÉRATURE
  申请人：PPG IND OHIO INC

  公开号：WO2018148323A1

  公开（公告）日：2018-08-16

  Disclosed herein is an adhesive composition comprising: an epoxy-containing component; and a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester, or thioester, or a combination thereof. Also disclosed are methods for forming a bonded substrate with the adhesive composition. Also disclosed is an article comprising first and second substrates and the adhesive composition.