2-Docosoxyethyl 2-methylprop-2-enoate | 115047-92-2

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: 2-Docosoxyethyl 2-methylprop-2-enoate
• 英文别名: 2-docosoxyethyl 2-methylprop-2-enoate
• CAS: 115047-92-2
• 化学式: C₂₈H₅₄O₃
• 分子量: 438.7
• InChiKey: KIOWXTOCDZJCBM-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  11.9
• 重原子数：
  31
• 可旋转键数：
  26
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.89
• 拓扑面积：
  35.5
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• Heat sealable lidding material with anti fog
  申请人：Kendig D. Terrance

  公开号：US20060105186A1

  公开（公告）日：2006-05-18

  A film coated with a surfactant or residue of a surfactant is disclosed. The film comprises, or is produced from, an ethylene copolymer or modified ethylene copolymer or ionomer thereof and a tackifier. The ethylene copolymer is a copolymer or terpolymer or tetrapolymer comprising repeat units derived from ethylene and about 5 to about 50 wt % of a polar monomer. The tackifier can comprise para-coumarone-indene resins, terpene resins, butadiene-styrene resins, polybutadiene resins, hydrocarbon resins, rosins, or combinations of two or more thereof. The monomer can be vinyl alkanoic acid, acrylic acid, alkyl acrylic acid, or alkyl acrylate, or combinations of two or more thereof.

  本发明公开了一种涂有表面活性剂或表面活性剂残留物的薄膜。薄膜由乙烯共聚物或改性乙烯共聚物或其离子聚合物和增粘剂组成，或由其制成。乙烯共聚物是一种共聚物、三元共聚物或四元共聚物，由源自乙烯的重复单元和约 5 至约 50 wt % 的极性单体组成。增粘剂可包括对位香豆酮茚树脂、萜烯树脂、丁二烯-苯乙烯树脂、聚丁二烯树脂、烃树脂、松香或其中两种或两种以上的组合。单体可以是乙烯基烷酸、丙烯酸、丙烯酸烷基酯或丙烯酸烷基酯，或其中两种或两种以上的组合。
• Amine-neutralized ethylene acid copolymers, shaped articles and laminates produced therefrom
  申请人：Anderson Jerrel C.

  公开号：US20080044666A1

  公开（公告）日：2008-02-21

  The present invention provides a resin composition comprising an amine-neutralized ethylene acid copolymer. These resin compositions copolymers may be characterized by enhanced adhesiveness and reduced crystallinity. Also provided are shaped articles, multilayer films or sheets, and laminate articles comprising the resin composition.
• Ruthenium-barrier polishing slurry
  申请人：Liu Zhendong

  公开号：US20080148649A1

  公开（公告）日：2008-06-26

  The polishing slurry is useful for removing ruthenium layers from patterned semiconductor substrates in the presence of at least one nonferrous interconnect metal and a dielectric. The polishing slurry includes 0.001 to 10 weight percent periodic acid or salt, at least 0.0001 weight percent inhibitor for reducing removal rate of the nonferrous interconnect metals, 0.00001 to 5 weight percent organic additive for reducing dielectric removal rate, the organic additive being selected from at least one of water soluble polymers and surfactants, the organic additive containing an ethylene oxide group or an amide group, 0.1 to 50 weight percent abrasive and balance water; and the slurry having a pH of greater than 8 to 12.
• Low modulus solar cell encapsulant sheets with enhanced stability and adhesion
  申请人：Hayes Richard Allen

  公开号：US20080190481A1

  公开（公告）日：2008-08-14

  The present invention provides a pre-formed bi-layer thermoplastic film or sheet comprising a first surface layer made of acid copolymers, or ionomers, or combinations thereof and a second surface layer made of ethylene acrylate ester copolymers, a solar cell pre-laminate assembly comprising the same, and a simplified process for manufacturing a solar cell module derived therefrom.
• Coextruded, Heat-Sealable and Peelable Polyester Film
  申请人：KONRAD Matthias

  公开号：US20090061137A1

  公开（公告）日：2009-03-05

  The invention relates to a coextruded, peelable, and biaxially oriented polyester film with a base layer (B) and with at least one outer layer (A) applied to this base layer (B). The outer layer (A) is heat-sealable and features peelability with respect to nonpolar substrates, such as polystyrene (“PS”) and polypropylene (“PP”). The heat-sealable and peelable outer layer (A) includes a copolymer formed from ethylene and an acrylate. The invention further relates to a process for the production of the film and to packaging formed from the film.