Palladium-catalyzed ortho-alkenylation of aryl hydrogen phosphates using a new mono-phosphoric acid directing group
作者:Li Yan Chan、Sunggak Kim、Taekyu Ryu、Phil Ho Lee
DOI:10.1039/c3cc41107a
日期:——
A highly efficient Pd-catalyzed ortho-alkenylation is reported using a mono-phosphoric acid-directing group for the first time. This phosphoric acid-directing group is successfully utilized for the synthesis of various alkenylated products and offers a new approach to transition-metal-catalyzed C-H activation.
Synthesis of 3-(substituted)-2,4,8,15-tetroxa-3-phosphadispiro[5.2.5]hexadecane-3-oxides
作者:C. Suresh Reddy、Y. Hari Babu、N. Ravi Sankar、C. Devendranath Reddy
DOI:10.1002/jhet.5570410630
日期:2004.11
Novel 3-(substituted)-2,4,8,15-tetroxa-3-phosphadispiro[5.2.5]hexadecane-3-oxides (3-12) have been synthesized by cyclization of 1,5-dioxaspiro[5.5]undecande-3,3-dimethanol (1) with various substituted aryl phosphorus dichloridates (2) in dry toluene-THF in the presence of triethylamine at 40-60 oC. Their molecular structures were determined by ir, nmr and mass spectral studies and were screened for
通过环化1,5-二氧杂螺[5.5]十一碳酸酯合成了新型3-(取代)-2,4,8,15-四氧-3-磷酸二螺[5.2.5]十六烷-3-氧化物(3-12)。在三乙胺存在下于40-60 o C在无水甲苯-THF中的-3,3-二甲醇(1)与各种取代的二氯化磷芳基磷酯(2)。其分子结构由ir,nmr和质谱研究确定,分别为筛选了针对弯曲弯曲菌和黑曲霉的抗真菌活性,以及对金黄色葡萄球菌和大肠杆菌的抗菌活性。他们大多数都有重要的活动。
Flame-retardant thermoset composition, method, and article
申请人:Campbell Robert John
公开号:US20050075427A1
公开(公告)日:2005-04-07
A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.
FLAME-RETARDANT THERMOSET COMPOSITION, METHOD, AND ARTICLE
申请人:Campbell Robert John
公开号:US20060167142A9
公开(公告)日:2006-07-27
A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.