The present disclosure relates to a thermally-conductive curable composition comprising:
a) a base component comprising a cationically self-curable silicone-based oligomeric compound;
b) a curing system for the cationically self-curable silicone-based oligomeric compound; and
c) a thermally-conductive filler.
According to another aspect, the present disclosure is directed to a method of manufacturing a thermally-conductive curable composition. In yet another aspect, the disclosure relates to the use of a thermally-conductive curable composition for industrial applications, in particular for thermal management applications in the automotive industry.
本公开涉及一种导热固化组合物,包括
a) 包含阳离子自固化
硅基低聚物化合物的基础成分;
b) 用于阳离子自固化
硅基低聚化合物的固化体系;以及
c) 导热填料。
根据另一个方面,本公开涉及一种热导性可固化组合物的制造方法。在另一个方面,本公开涉及热导性可固化组合物在工业应用中的使用,特别是在汽车工业中的热管理应用。