申请人:Mitsubishi Chemical Corporation
公开号:EP1561765A1
公开(公告)日:2005-08-10
A radiation-curable resin composition comprising an inorganic component containing a silica particle composed of a hydrolyzate of an oligomer of an alkoxysilane and a monomer and/or an oligomer thereof, wherein viscosity at 25°C is from 1,000 to 10,000 centipoises.
一种辐射固化树脂组合物,其中包含一种无机成分,该无机成分含有由烷氧基硅烷的低聚物及其单体和/或低聚物的水解物组成的二氧化硅颗粒,25°C 时的粘度为 1,000 至 10,000 厘泊。