Novolac resin-containing resist underlayer film-forming composition using bisphenol aldehyde
申请人:NISSAN CHEMICAL INDUSTRIES, LTD.
公开号:US10017664B2
公开(公告)日:2018-07-10
Resist underlayer film-forming composition for forming resist underlayer film with high dry etching resistance, wiggling resistance and exerts good flattening property and embedding property for uneven parts, including resin obtained by reacting organic compound A including aromatic ring and aldehyde B having at least two aromatic hydrocarbon ring groups having phenolic hydroxy group and having structure wherein the aromatic hydrocarbon ring groups are bonded through tertiary carbon atom. The aldehyde B may be compound of Formula (1):
The obtained resin may have a unit structure of Formula (2):
Ar1 and Ar2 each are C6-40 aryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent. Forming resist pattern used for semiconductor production, including forming resist underlayer film by applying the resist underlayer film-forming composition onto semiconductor substrate and baking it.
ALLYLOXY DERIVATIVE, RESIST UNDERLAYER FORMING COMPOSITION USING THE SAME, AND METHOD OF MANUFACTURING RESIST UNDERLAYER AND SEMICONDUCTOR DEVICE USING THE SAME
申请人:Merck Patent GmbH
公开号:US20210181636A1
公开(公告)日:2021-06-17
The present invention provides a resist underlayer forming composition, which is well in heat resistance and gap filling. Further, the present invention provides methods of manufacturing a resist underlayer and semiconductor device using it. [Means for Solution] A composition comprising a allyloxy derivative having a specific group and a solvent, and methods of manufacturing a resist underlayer and semiconductor device using it.
Several homoxacalix[3]arenes possessing different substituents on their upper rims were synthesized in yields of 7-20% by a condensation reaction between the p-substituted phenol dimer and monomer under acidic high-dilution conditions.
Novolak compounds useful as adhesion promoters for epoxy resins
申请人:Minnesota Mining and Manufacturing Company
公开号:US05859153A1
公开(公告)日:1999-01-12
A composition useful as a powder coating comprises an epoxy resin and a novolak compound or resin having a structure obtained from the reaction of a substituted phenol such as cresol and an aldehyde to form a substituted bis(hydroxymethyl) phenol intermediate which is then reacted with a polyhydroxyphenol containing adjacent hydroxyl groups such as catechol to yield a polyhydroxyphenol-endcapped novolak compound or resin.