Photoresist patterns are formed using a photoresist composition, which includes water, a photoacid generator, and a negative photoresist polymer. The polymer includes a basic-type repeating unit represented by Formula (I) (shown below), so that a developing process can be performed not by using conventional TMAH solution but by using water. Additionally, since the main solvent of the composition is water, the disclosed photoresist composition is eco-friendly, and has a low light absorbance at 193 nm and 248 nm, which is useful in a photolithography process using light source in a far ultraviolet region when high-integrated fine circuits of semiconductor device are manufactured.
wherein R
1
, R
2
, R
3
, R
4
, R
5
, R
6
, R
7
, b, c, d and m are defined in the specification.
使用光阻组合物形成光阻图案,该组合物包括
水、光酸发生剂和负型光阻聚合物。聚合物包括由式(I)表示的碱性重复单元,因此可以通过使用
水而不是传统的TMAH溶液进行显影过程。此外,由于组合物的主溶剂是
水,因此所披露的光阻组合物具有环保性,并且在制造半导体器件的高集成细微电路时使用远紫外光源的光刻工艺中,具有193nm和248nm的低光吸收率,这是有用的。其中R1、R2、R3、R4、R5、R6、R7、b、c、d和m在规范中有定义。