The invention provides a water-soluble prefluxe that can solve problems with a soldering land array having a narrow spacing in that fused solder is likely to cause soldering bridges with defective soldering, a printed circuit board with its film formed thereon, and a surface treatment process for a metal in that circuit. The water-soluble preflus comprises given two different benzimidazoles compound and an iodine-based compound optionally with an amino acid, etc. The invention provides a printed circuit board with a film of that preflux formed thereon, and a surface treatment process for the metal in that circuit.
本发明提供了一种
水溶性预熔剂,它可以解决焊接地阵列间距较窄,熔化焊料容易造成焊接桥和焊接缺陷的问题,还提供了一种印刷电路板及其上形成的薄膜,以及该电路中
金属的表面处理工艺。
水溶性预熔剂包括给定的两种不同的
苯并咪唑化合物和一种
碘基化合物(可选)以及一种
氨基酸等。本发明提供了一种印刷电路板,其上形成了一层该预熔剂的薄膜,以及该电路中
金属的表面处理工艺。