Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board
申请人:——
公开号:US20030141351A1
公开(公告)日:2003-07-31
The invention provides a water-soluble prefluxe that can solve problems with a soldering land array having a narrow spacing in that fused solder is likely to cause soldering bridges with defective soldering, a printed circuit board with its film formed thereon, and a surface treatment process for a metal in that circuit. The water-soluble preflus comprises given two different benzimidazoles compound and an iodine-based compound optionally with an amino acid, etc. The invention provides a printed circuit board with a film of that preflux formed thereon, and a surface treatment process for the metal in that circuit.
本发明提供了一种水溶性预熔剂,它可以解决焊接地阵列间距较窄,熔化焊料容易造成焊接桥和焊接缺陷的问题,还提供了一种印刷电路板及其上形成的薄膜,以及该电路中金属的表面处理工艺。水溶性预熔剂包括给定的两种不同的苯并咪唑化合物和一种碘基化合物(可选)以及一种氨基酸等。本发明提供了一种印刷电路板,其上形成了一层该预熔剂的薄膜,以及该电路中金属的表面处理工艺。