Disclosed is a display panel including a lower substrate, upper substrate, and a patterned spacer that causes the lower substrate and upper substrate to be spaced apart from each other by a predetermined distance, wherein the patterned spacer is obtained from a photo-sensitive resin composition comprising: (a) a triazine-based photopolymerization initiator represented by the following formula 1; (b) an alkali-soluble photo polymerizable reactive resin binder; and (c) a polymerizable compound:
(wherein each of R1-R5 has the same meaning as defined herein). A photosensitive resin composition for use in a patterned spacer is also disclosed, the composition comprising: (a) a triazine-based photopolymerization initiator represented by the following formula 1; (b) an alkali-soluble photopolymerizable reactive resin binder; (c) a polymerizable compound; and (d) a solvent. The photosensitive resin composition shows high sensitivity and excellent properties related with development, and provides a patterned spacer having excellent strength, sensitivity, residue characteristics, film uniformity, residual film ratio, etc.
Transparent, highly heat-resistant polyimide precursor and photosensitive polyimide composition thereof
申请人:Kim Dong-seok
公开号:US20070093640A1
公开(公告)日:2007-04-26
The present invention relates to an aqueous alkali-developable photosensitive polyimide precursor resin composition that is appropriate for highly heat-resistant transparent protection layers and insulation layers for liquid crystal display devices. In more detail, the present invention relates to a negative-type photosensitive transparent polyimide precursor resin composition manufactured in two steps. The first step is the manufacture of a transparent linear polyamic acid (A) from (a-1) one or more kinds of tetracarboxylic acid dianhydrides selected from alicyclic tetracarboxylic acid dianhydrides having 3 to 30 carbon atoms; and (a-2) one or more kinds of diamines selected from aliphatic, alicyclic, or non-conjugated aromatic diamines, having 3 to 30 carbon atoms, having one or more ethylenically unsaturated bonds at side chains as essential components; and the second step is the manufacture of reactive transparent polyimide precursors shown in the following Chemical Formula 1 according to the esterification reaction of the above polyamic acid (A) with ethylenically unsaturated compound (B) containing an epoxy group in the same molecule as the main component. The photosensitive transparent polyimide precursor resin compositions according to the present invention have a superior photosensitivity, and thus, may be used for transparent protection layers and insulation layers of liquid crystal display devices having superior heat resistance, chemical resistance, mechanical strength, and electricity insulation.
TRANSPARENT, HIGHLY HEAT-RESISTANT POLYIMIDE PRECURSOR AND PHOTOSENSITIVE POLYIMIDE COMPOSITION THEREOF
申请人:KIM Dong-Seok
公开号:US20120308741A1
公开(公告)日:2012-12-06
The present invention relates to an aqueous alkali-developable photosensitive polyimide precursor resin composition that is appropriate for highly heat-resistant transparent protection layers and insulation layers for liquid crystal display devices.