[2-(Octyloxy)phenyl](phenyl)iodanium | 126691-49-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯酚醚
• 英文名称: [2-(Octyloxy)phenyl](phenyl)iodanium
• 英文别名: (2-octoxyphenyl)-phenyliodanium
• CAS: 126691-49-4
• 化学式: C20H26IO+
• 分子量: 409.3
• InChiKey: VBXWOQXZPZWRBB-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  7.7
• 重原子数：
  22
• 可旋转键数：
  10
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.4
• 拓扑面积：
  9.2
• 氢给体数：
  0
• 氢受体数：
  1

文献信息

• Method for making octyloxy substituted diphenyl iodonium hexafluoro metalloid salts
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP0425920B1

  公开（公告）日：1994-08-31
• USE OF CROSS-LINKER AND COMPOSITIONS MADE THEREFROM
  申请人：UCB S.A.

  公开号：EP1309645A2

  公开（公告）日：2003-05-14
• ADHESIVE COMPOSITIONS FOR HIGH TEMPERATURE SENSORS AND METHODS OF MAKING THE SAME
  申请人：Lu Qiwei

  公开号：US20090107632A1

  公开（公告）日：2009-04-30

  An adhesive composition is provided which effectively bonds a sensor to a surface having a temperature up to approximately 250° C. The adhesive composition comprises an epoxy resin and a latent cationic cure catalyst effective to cure the epoxy resin. The invention also provides a method of preparing an adhesive composition comprising blending an epoxy resin and a latent cationic cure catalyst effective to cure the epoxy resin, wherein the composition is capable of effectively bonding a sensor to a surface having a temperature up to approximately 250° C. The invention further provides a method of bonding a sensor to a surface comprising the steps of applying an adhesive composition to a first surface of the sensor or to a surface area of an object to be monitored, the adhesive composition comprising an epoxy compound and a latent cationic cure catalyst effective to cure the epoxy resin. The first surface of the sensor is contacted with the surface area of the object whereby the adhesive composition is located therebetween, and wherein the composition effectively bonds the sensor to the object surface at a temperature up to approximately 250° C.
• CURABLE RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS FOR USE WITH LOW-K DIELECTRIC-CONTAINING SEMICONDUCTOR DEVICES
  申请人：Nguyen My Nhu

  公开号：US20110133344A1

  公开（公告）日：2011-06-09

  This invention relates to thermosetting resin compositions useful for flip chip (“FC”) underfill sealant materials, where a semiconductor chip is mounted directly onto a circuit through solder electrical interconnections. Similarly, the compositions are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate.
• US8698320B2
  申请人：——

  公开号：US8698320B2

  公开（公告）日：2014-04-15