申请人:——
公开号:US20040247896A1
公开(公告)日:2004-12-09
The present composition provides a composition comprising: (a) thermosetting component wherein the thermosetting component comprises monomer having the structure dimer having the structure or a mixture of the monomer and the dimer wherein Y is selected from cage compound and silicon atom; R
1
, R
2
, R
3
, R
4
, R
5
, and R
6
are independently selected from aryl, branched aryl, and arylene ether; at least one of the aryl, the branched aryl, and the arylene ether has an ethynyl group; R
7
is aryl or substituted aryl; and at least one of the R
1
, R
2
, R
3
, R
4
, R
5
, and R
6
comprises at least two isomers; and (b) adhesion promoter comprising compound having at least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting with a substrate when the composition is applied to a substrate. The present composition is particularly useful as a dielectric material in microelectronic
1
本组合物提供了一种组合物,包括:(a)热固性组分,其中热固性组分包括具有二聚体结构或混合物的单体,其中Y选自笼状化合物和硅原子;R1、R2、R3、R4、R5和R6分别独立地选自芳基、支链芳基和芳基醚;其中至少一个芳基、支链芳基和芳基醚具有一个乙炔基;R7是芳基或取代芳基;其中至少一个R1、R2、R3、R4、R5和R6包含至少两个异构体;以及(b)粘附促进剂,包括至少具有双重功能性的化合物,其中双重功能性可以相同或不同,第一功能能够与热固性组分(a)相互作用,第二功能能够与基底相互作用,当该组合物应用于基底时,本组合物特别适用于微电子中的介电材料。