Epoxy Resins With High Thermal Stability and Toughness
申请人:Kincaid Derek Scott
公开号:US20140069583A1
公开(公告)日:2014-03-13
Epoxy resin compositions contain (i) a polyepoxide resin; (ii) a benzofuran diol component, a benzofuran di-epoxide component, or mixture thereof; and (iii) a curing agent, which upon curing, provides a cured resin exhibiting improved chemical and physical characteristics. The epoxy resin composition may also contain a toughening agent to further enhance the cured resin's physical characteristics.
US9051498B2
申请人:——
公开号:US9051498B2
公开(公告)日:2015-06-09
[EN] POLYCYCLIC COMPOUNDS FOR ELECTRONIC APPLICATIONS<br/>[FR] COMPOSÉS POLYCYCLIQUES POUR DES APPLICATIONS ÉLECTRONIQUES
申请人:BASF SE
公开号:WO2010046259A1
公开(公告)日:2010-04-29
The present invention relates to electronic devices, especially electroluminescent devices, comprising compounds of formula (I), and/or (II), especially as host for phosphorescent emitters, electron transporting materials, or emitter materials. The hosts may function with phosphorescent materials to provide improved efficiency, stability, manufacturability, or spectral characteristics of electroluminescent devices.