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19-Methylidene-7,18-diazaheptacyclo[14.6.2.22,5.03,12.04,9.013,23.020,24]hexacosa-1(23),2,4,9,11,13,15,20(24),21,25-decaene-6,8,17-trione

中文名称
——
中文别名
——
英文名称
19-Methylidene-7,18-diazaheptacyclo[14.6.2.22,5.03,12.04,9.013,23.020,24]hexacosa-1(23),2,4,9,11,13,15,20(24),21,25-decaene-6,8,17-trione
英文别名
19-methylidene-7,18-diazaheptacyclo[14.6.2.22,5.03,12.04,9.013,23.020,24]hexacosa-1(23),2,4,9,11,13,15,20(24),21,25-decaene-6,8,17-trione
19-Methylidene-7,18-diazaheptacyclo[14.6.2.22,5.03,12.04,9.013,23.020,24]hexacosa-1(23),2,4,9,11,13,15,20(24),21,25-decaene-6,8,17-trione化学式
CAS
——
化学式
C25H12N2O3
mdl
——
分子量
388.4
InChiKey
XSXMUHGLQKWAKY-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    4
  • 重原子数:
    30
  • 可旋转键数:
    0
  • 环数:
    7.0
  • sp3杂化的碳原子比例:
    0.0
  • 拓扑面积:
    75.3
  • 氢给体数:
    2
  • 氢受体数:
    3

文献信息

  • EXCIMER FORMING COMPOUNDS
    申请人:THE GOVERNING COUNCIL OF THE UNIVERSITY OF TORONTO
    公开号:US20160304473A1
    公开(公告)日:2016-10-20
    The present application is directed to excimer forming compounds of Formula I: W—V—[Y] n wherein W is an excimer forming fluorophore, V is a linker moiety, Y is a metal ion coordinating moiety and n is 1, 2 or 3. In particular, the application is directed to excimer forming compounds for the detection of proximally phosphorylated sites including those found on polypeptides, proteins, pyrophosphate and RNA, for example in aqueous solution, polyacrylamide gels blotting membranes, solid-support assays and in cell culture samples.
  • US9459222B2
    申请人:——
    公开号:US9459222B2
    公开(公告)日:2016-10-04
  • [EN] METHODS FOR DEPOSITION OF MATERIALS INCLUDING MECHANICAL ABRASION<br/>[FR] PROCÉDÉS PERMETTANT LE DÉPÔT DE MATÉRIAUX COMPORTANT UNE ABRASION MÉCANIQUE
    申请人:MASSACHUSETTS INST TECHNOLOGY
    公开号:WO2013180801A1
    公开(公告)日:2013-12-05
    Methods described herein may be useful in the fabrication and/or screening of devices (e.g., sensors, circuits, etc.) including conductive materials. In some embodiments, a conductive material is formed on a substrate using mechanical abrasion. The methods described herein may be useful in fabricating sensors, circuits, tags for remotely-monitored sensors or human/object labeling and tracking, among other devices. In some cases, devices for determining analytes are also provided.
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