RESIN COMPOSITION, HARDENED COATING FILMS THEREFROM, AND PHOTOSEMICONDUCTOR DEVICE USING SAME
申请人:Kameyama Atsushi
公开号:US20140128510A1
公开(公告)日:2014-05-08
A resin composition prepared by blending an epoxy compound represented by the following formula (1), an acid anhydride, and a curing accelerator, wherein the epoxy compound is purified in such a way that, in a chromatogram obtained by gas chromatographic analysis, a ratio of a peak area B of peaks derived from a heavier molecular mass portion having longer retention times than the epoxy compound to a peak area A of peak(s) derived from the epoxy compound B/A is 2.0×10
−3
or less.
[In the formula, R
1
, R
2
, R
3
, R
4
, R
5
, R
6
, R
7
, R
8
, R
9
, R
10
, R
11
, and R
12
each independently represent a hydrogen atom, a halogen atom, an alkyl group which may have a substituent, or an alkoxy group which may have a substituent.]