[(E)-[3-[acetyl(acetyloxy)amino]-1-[9-ethyl-6-(naphthalene-1-carbonyl)carbazol-3-yl]butylidene]amino] acetate

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吲哚及其衍生物
• 英文名称: [(E)-[3-[acetyl(acetyloxy)amino]-1-[9-ethyl-6-(naphthalene-1-carbonyl)carbazol-3-yl]butylidene]amino] acetate
• 化学式: C₃₅H₃₃N₃O₆
• 分子量: 591.7
• InChiKey: RHSKWWVRDZURKC-WIKZRCHHSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.2
• 重原子数：
  44
• 可旋转键数：
  11
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.23
• 拓扑面积：
  107
• 氢给体数：
  0
• 氢受体数：
  7

文献信息

• SILICON-CONTAINING RESIN COMPOSITION
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：EP3705534A1

  公开（公告）日：2020-09-09

  Provided are a silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the silicon-containing resin composition, and a crack-free silica-based coating film formed using the silicon-containing resin composition. A silicon-containing resin composition including (A) a silicon-containing resin and (S) a solvent, wherein one or more selected from siloxane resins and polysilanes is used as the (A) silicon-containing resin, and the (S) solvent contains a cycloalkyl acetate having a specific structure. Cyclohexyl acetate is preferably used as the cycloalkyl acetate.

  本发明提供了一种含硅树脂组合物，使用该组合物可形成硅基涂膜，其中裂纹的产生减至最小；还提供了一种使用该含硅树脂组合物形成硅基涂膜的方法，以及一种使用该含硅树脂组合物形成的无裂纹硅基涂膜。含硅树脂组合物包括（A）含硅树脂和（S）溶剂，其中（A）含硅树脂使用硅氧烷树脂和聚硅烷中的一种或多种，（S）溶剂包含具有特定结构的环烷基乙酸酯。环烷基乙酸酯最好使用环己基乙酸酯。
• Silicon-containing resin composition
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US10689514B2

  公开（公告）日：2020-06-23

  A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the silicon-containing resin composition, and a crack-free silica-based coating film formed using the silicon-containing resin composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

  一种含硅树脂组合物，使用该组合物可形成可最大限度减少裂纹产生的硅基涂膜；一种使用该含硅树脂组合物形成硅基涂膜的方法；以及一种使用该含硅树脂组合物形成的无裂纹硅基涂膜。含硅树脂组合物包括含硅树脂和溶剂，其中硅氧烷树脂和聚硅烷中的一种或多种用作含硅树脂，溶剂含有具有特定结构的环烷基乙酸酯。
• Energy-sensitive resin composition
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US10696845B2

  公开（公告）日：2020-06-30

  An energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. A method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance. The energy-sensitive resin composition includes an imidazole compound, a resin precursor component, and a solvent, the resin precursor component being at least one of a monomer component including a diamine compound, a dicarbonyl compound and/or a tetracarboxylic acid dianhydride; and a precursor polymer having a repeating unit.

  一种能量敏感树脂组合物，使用该组合物，即使在低温下对前体聚合物进行热处理，也能生产出一种薄膜或模塑制品，该薄膜或模塑制品由具有优异耐热性、拉伸伸长率和耐化学性且介电常数较低的含亚胺环聚合物组成，或由具有优异耐热性、拉伸伸长率和耐化学性的含噁唑环聚合物组成。制造薄膜或模塑制品的方法；使用能量敏感树脂组合物形成图案的方法；以及具有优异耐热性、拉伸伸长率和耐化学性的永久性薄膜。能敏树脂组合物包括咪唑化合物、树脂前体组分和溶剂，树脂前体组分是单体组分中的至少一种，包括二胺化合物、二羰基化合物和/或四羧酸二酐；以及具有重复单元的前体聚合物。
• ENERGY-SENSITIVE RESIN COMPOSITION
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US20150338734A1

  公开（公告）日：2015-11-26

  The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperature. The composition contains polyamic acid obtained by reacting tetracarboxylic dianhydride and diamine, a solvent, and a compound (A) decomposing by the action of light and/or heat and generating a base and/or an acid. The method of manufacturing a polyimide film or a polyimide molded product includes forming a coating film or molded product comprising the composition and decomposing the compound (A) in the film or product through exposure or heating. The method of forming a pattern sequentially includes forming, selectively exposing, developing and heating the film or product.
• LIQUID COMPOSITION, QUANTUM DOT-CONTAINING FILM, OPTICAL FILM, LIGHT-EMITTING DISPLAY ELEMENT PANEL, AND LIGHT-EMITTING DISPLAY DEVICE
  申请人：TOKYO OHKA KOGYO CO., LTD.

  公开号：US20210309866A1

  公开（公告）日：2021-10-07

  The present invention provides: a liquid composition which can be suitably used for production of an optical film having a favorable fluorescence efficiency and includes quantum dots (A), a quantum dot-containing film obtained by drying and/or curing the liquid composition, an optical film for a light-emitting display element made of the quantum dot-containing film, a light-emitting display element panel including the optical film, and a light-emitting display equipped with the light-emitting display element panel. An ionic liquid (B), and a solvent (S) are incorporated into a liquid composition including quantum dots (A), in which the solvent (S) includes a solvent (S1), the solvent (S1) being a compound having a cyclic skeleton and including a heteroatom other than a hydrogen atom and a carbon atom.