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Pentacyclo[12.7.0.02,7.08,13.015,20]henicosa-1(14),2(7),3,5,8,10,12,15,17,19-decaen-3-ol

中文名称
——
中文别名
——
英文名称
Pentacyclo[12.7.0.02,7.08,13.015,20]henicosa-1(14),2(7),3,5,8,10,12,15,17,19-decaen-3-ol
英文别名
pentacyclo[12.7.0.02,7.08,13.015,20]henicosa-1(14),2(7),3,5,8,10,12,15,17,19-decaen-3-ol
Pentacyclo[12.7.0.02,7.08,13.015,20]henicosa-1(14),2(7),3,5,8,10,12,15,17,19-decaen-3-ol化学式
CAS
——
化学式
C21H14O
mdl
——
分子量
282.3
InChiKey
GSJNBSDSUCSENO-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    5.7
  • 重原子数:
    22
  • 可旋转键数:
    0
  • 环数:
    5.0
  • sp3杂化的碳原子比例:
    0.05
  • 拓扑面积:
    20.2
  • 氢给体数:
    1
  • 氢受体数:
    1

文献信息

  • RESIN HAVING FLUORENE STRUCTURE AND UNDERLAYER FILM-FORMING MATERIAL FOR LITHOGRAPHY
    申请人:Mitsubishi Gas Chemical Company, Inc.
    公开号:EP2762513A1
    公开(公告)日:2014-08-06
    There are provided a novel resin having a fluorene structure which has a relatively high carbon concentration in the resin, which has a relatively high heat resistance and also a relatively high solvent solubility, and which can be applied to a wet process, and a method for producing the resin, as well as a material for forming an underlayer film useful for forming a novel resist underlayer film excellent in heat resistance and etching resistance as an underlayer film for multilayer resist, and a pattern forming method using the material. The resin of the present invention has a structure represented by the following general formula (1). (in the general formula (1), each of R3 and R4 independently denotes a benzene ring or a naphthalene ring, a carbon atom at the bridgehead of a fluorene backbone or (di)benzofluorene backbone is bonded with a carbon atom of each of other aromatic rings, and a carbon atom of each of aromatic rings of a fluorene backbone or (di)benzofluorene backbone is bonded with a carbon atom at the bridgehead of other fluorene backbone or (di)benzofluorene backbone.)
    本发明提供了一种具有芴结构的新型树脂,该树脂中的碳浓度相对较高,具有相对较高的耐热性和相对较高的溶剂溶解性,可应用于湿法工艺,还提供了一种生产该树脂的方法,以及一种用于形成底层膜的材料,该底层膜可用于形成耐热性和耐蚀刻性优异的新型抗蚀剂底层膜,作为多层抗蚀剂的底层膜,还提供了一种使用该材料的图案形成方法。本发明的树脂具有以下通式 (1) 所表示的结构。 (在通式(1)中,R3 和 R4 各自独立地表示苯环或萘环,芴骨架或(二)苯并芴骨架桥头的一个碳原子与其他每个芳香环的一个碳原子键合、芴骨架或(二)苯并芴骨架的每个芳香环的碳原子与其他芴骨架或(二)苯并芴骨架桥头的碳原子键合。)
  • RESIN HAVING FLUORENE STRUCTURE AND MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY
    申请人:Higashihara Go
    公开号:US20140246400A1
    公开(公告)日:2014-09-04
    A resin having a fluorene structure, a relatively high carbon concentration in the resin, a relatively high heat resistance and a relatively high solvent solubility has a structure represented by wherein each of R 3 and R 4 independently denotes a benzene ring or a naphthalene ring, a carbon atom at the bridgehead of a fluorene backbone or (di)benzofluorene backbone is bonded with a carbon atom of each of other aromatic rings, and a carbon atom of each of aromatic rings of a fluorene backbone or (di)benzofluorene backbone is bonded with a carbon atom at the bridgehead of other fluorene backbone or (di)benzofluorene backbone. The resin can be applied to a wet process. Methods for producing the resin, for forming an underlayer film useful for forming a novel resist, and for pattern forming using the material, and an underlayer film excellent in heat resistance and etching resistance for multilayer resist are described.
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