There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The phenolic resin contains a binuclear compound (X) represented by the following Structural Formula (I), and a trinuclear compound (Y) represented by the following Structural Formula (II) as essential components:
wherein each of j and k is 1 or 2, and at least one of j and k is 2;
wherein each of l, m and n is 1 or 2, and at least one of l, m, and n is 2.
US4269952A
申请人:——
公开号:US4269952A
公开(公告)日:1981-05-26
US9902798B2
申请人:——
公开号:US9902798B2
公开(公告)日:2018-02-27
Hydroquinone-Based Biarylic Polyphenols as Redox Organocatalysts for Dioxygen Reduction: Dramatic Effect of Orcinol Substituent on the Catalytic Activity
It is shown that the resorcinol moiety substituted on its meta position has a strong impact on the catalytic activities of these compounds towards the reduction of dioxygen by diethylhydroxylamine (DEHA) in aqueous medium. While the derivative consisting of the two cores spaced by three methylene units is completely inactive, substitution on the hydroquinone part leads to tremendously active catalysts