6,11-[1'2']-benzeno-1,4-methano-5,12-dimethoxy-1,4,6,11-tetrahydrotetracene | 632621-32-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 蒽
• 英文名称: 6,11-[1'2']-benzeno-1,4-methano-5,12-dimethoxy-1,4,6,11-tetrahydrotetracene
• 英文别名: 3,10-Dimethoxyheptacyclo[10.6.6.15,8.02,11.04,9.013,18.019,24]pentacosa-2,4(9),6,10,13,15,17,19,21,23-decaene；3,10-dimethoxyheptacyclo[10.6.6.15,8.02,11.04,9.013,18.019,24]pentacosa-2,4(9),6,10,13,15,17,19,21,23-decaene
• CAS: 632621-32-0
• 化学式: C₂₇H₂₂O₂
• 分子量: 378.47
• InChiKey: XXWMFRTZXILAFO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.8
• 重原子数：
  29
• 可旋转键数：
  2
• 环数：
  8.0
• sp3杂化的碳原子比例：
  0.26
• 拓扑面积：
  18.5
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  9,10-二氢-9,10[1',2']-苯并蒽-1,4-二酮 在 sodium hydride 作用下， 以 N,N-二甲基甲酰胺 、 乙腈 为溶剂， 反应 23.5h， 生成 6,11-[1'2']-benzeno-1,4-methano-5,12-dimethoxy-1,4,6,11-tetrahydrotetracene
  参考文献：
  名称：

  Molecular Design of Free Volume as a Route to Low-κ Dielectric Materials

  摘要：

  Polymers incorporating the triptycene subunit were prepared for the molecular-level design of low dielectric constant (low-kappa) materials that can be used to manufacture faster integrated circuits. Triptycenes having restricted rotation by multiple point attachment to the polymer backbone are shown to introduce free volume into the films, thereby lowering their dielectric constants. The triptycene containing polymers exhibit a number of desirable properties including low-water absorption and high thermal stability. Systematic studies wherein comparisons are made between two separate classes of triptycene polymers and their non-triptycene containing analogues demonstrate that proper insertion of triptycenes into a polymer backbone can give rise to a reduction in the material's dielectric constant while also improving its mechanical properties. These characteristics are desired by the semiconductor industry for the next generation of microprocessors and memory to provide insulation of the increasingly shrinking features.

  DOI：

  10.1021/ja0360945

文献信息

• Polymers with high internal free volume
  申请人：Swager Timothy M.

  公开号：US20080188634A1

  公开（公告）日：2008-08-07

  Shape-persistent organic materials, including polymers, with large degrees of interior free volume are described, along with behaviors and phenomena enabled by their unique properties. One class of such a material is built up from triptycene base moieties wherein three benzene rings are bridged together about a [2.2.2] tricyclic ring system. These units can be assembled into discreet molecules and polymers. These materials and/or formulations thereof with liquid crystals or polymers are useful for the complexation of chemicals and/or polymers; they have very low dielectric constants for use as coatings in dielectric circuits, they provide additional ordering mechanisms in liquid crystals, and they display unusual mechanical responses when subjected to electrochemical, chemical, or mechanical stimuli.

  本文介绍了具有大量内部自由体积的形状持久的有机材料，包括聚合物，以及由其独特性质所启用的行为和现象。这类材料之一是由三苯基环基团组成的，其中三个苯环通过一个[2.2.2]三环环系桥接在一起。这些单元可以组装成离散分子和聚合物。这些材料和/或其与液晶或聚合物的配方对于化学物质和/或聚合物的络合非常有用；它们具有非常低的介电常数，可用作介电电路的涂层，它们在液晶中提供额外的排序机制，并且在受到电化学、化学或机械刺激时显示出不寻常的机械响应。
• US7494698B2
  申请人：——

  公开号：US7494698B2

  公开（公告）日：2009-02-24
• Molecular Design of Free Volume as a Route to Low-κ Dielectric Materials
  作者：Timothy M. Long、Timothy M. Swager

  DOI：10.1021/ja0360945

  日期：2003.11.1

  Polymers incorporating the triptycene subunit were prepared for the molecular-level design of low dielectric constant (low-kappa) materials that can be used to manufacture faster integrated circuits. Triptycenes having restricted rotation by multiple point attachment to the polymer backbone are shown to introduce free volume into the films, thereby lowering their dielectric constants. The triptycene containing polymers exhibit a number of desirable properties including low-water absorption and high thermal stability. Systematic studies wherein comparisons are made between two separate classes of triptycene polymers and their non-triptycene containing analogues demonstrate that proper insertion of triptycenes into a polymer backbone can give rise to a reduction in the material's dielectric constant while also improving its mechanical properties. These characteristics are desired by the semiconductor industry for the next generation of microprocessors and memory to provide insulation of the increasingly shrinking features.