Amidoxime-Containing Ti Precursors for Atomic Layer Deposition of TiN Thin Films with Suppressed Columnar Microstructure
作者:Ga Yeon Lee、Seungmin Yeo、Chan-Mi Cho、Seung Hoon Oh、Hyeonbin Park、Bo Keun Park、Seung Uk Son、Taeyong Eom、Taek-Mo Chung
DOI:10.1021/acs.inorgchem.3c00141
日期:2023.3.20
was achieved by varying the injection/purge duration. TiN thin film growths were observed with a growth per cycle (GPC) of 0.05–0.13 nm·cy–1 at deposition temperatures between 150 and 300 °C, while the measured resistivity was as low as 420 μΩ·cm. The high reactivity of the precursor promotes nucleation, resulting in TiN thin films with smooth, good step coverage and preferentially orientated microstructure
本文报道了三种含有偕胺肟配体的新型钛络合物的合成,作为使用原子层沉积 (ALD) 制造的氮化钛 (TiN) 薄膜的潜在前体。一系列配体,即N'-甲氧基-N-甲基苯甲酰胺 (mnnoH)、N'-乙氧基-N-甲基乙酰胺 (ennoH) 和N'-甲氧基-N-甲基苯甲酰亚胺 (pnnoH) 被成功合成并用于生产 Ti(mnno)(NMe 2 ) 3 ( 4 )、Ti(enno)(NMe 2 ) 3 ( 5 ) 和 Ti(pnno)(NMe 2 )3(6)。配合物4 – 6的热重分析曲线显示单步重量损失高达 200 °C。热解发生在 200 °C 以上。在这三种新配合物中,有5 种在室温下呈液态。因此,使用 Ti(enno)(NMe 2 ) 3 ( 5 ) 作为新型前体,通过 ALD 合成 TiN 。由 Ti(enno)(NMe 2 ) 3 ( 5)前体和 NH 3等离子体沉积 TiN 薄膜,并通过