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1-Acetoxy-4-s-butoxy-butan | 60905-43-3

中文名称
——
中文别名
——
英文名称
1-Acetoxy-4-s-butoxy-butan
英文别名
4-Butan-2-yloxybutyl acetate;4-butan-2-yloxybutyl acetate
1-Acetoxy-4-s-butoxy-butan化学式
CAS
60905-43-3
化学式
C10H20O3
mdl
——
分子量
188.267
InChiKey
QVBMGOUDBGPPNB-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    2
  • 重原子数:
    13
  • 可旋转键数:
    8
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    0.9
  • 拓扑面积:
    35.5
  • 氢给体数:
    0
  • 氢受体数:
    3

反应信息

  • 作为产物:
    参考文献:
    名称:
    烷基卤化物与汞 (II) 盐在四氢呋喃中的反应。4-烷氧基丁基乙酸酯和氯化物的简便制备
    摘要:
    伯和仲烷基碘化物和溴化物与 Hg(OAc)2 和 HgCl2 在四氢呋喃 (THF) 中的反应得到掺入 THF 的化合物 (1),RO(CH2)4X [X=OAc 和 Cl,分别]产量。当 HgBr2 和水或醇 Hg(ClO4)2 用作汞 (II) 盐时,1(X=Br、OH 和 OR') 的产率很低。用 HgI2 进行类似处理几乎没有得到任何 1。 提出了一种涉及 O-烷基四氢呋喃离子作为中间体的反应方案,用于形成 1。
    DOI:
    10.1246/bcsj.49.2500
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文献信息

  • [EN] PREPARATION OF HIGH CONDUCTIVITY COPPER FILMS<br/>[FR] PRÉPARATION DE FILMS DE CUIVRE A CONDUCTIVITÉ ÉLEVÉE
    申请人:NAT RES COUNCIL CANADA
    公开号:WO2016197234A1
    公开(公告)日:2016-12-15
    A copper precursor composition contains: a first copper complex of an imine or a first cyclic amine coordinated to a first copper precursor compound; and, a second copper complex of a primary amine or a second cyclic amine coordinated to a second copper precursor compound. A copper precursor composition contains a copper complex of an imine coordinated to a copper precursor compound. The copper precursor composition is thermally degradable at a temperature lower than a comparable composition containing only primary amine copper complexes under otherwise the same conditions to produce a metallic copper film having a resistivity of about 200 μΩ-cm or less. Inks containing the copper precursor composition and a solvent may be deposited on a substrate and sintered to produce a metallic copper film. The substrate with the film thereon is useful in electronic devices.
    一种铜前体组合物包含:第一铜前体化合物配位到一种亚胺或第一环状胺的第一铜络合物;以及,第二铜前体化合物配位到一种一级胺或第二环状胺的第二铜络合物。一种铜前体组合物包含一种亚胺配位到一种铜前体化合物的铜络合物。在温度低于仅含一级胺铜络合物的相似组合物的情况下,该铜前体组合物在热降解时产生电阻率约为200μΩ-cm或更低的金属铜膜。含有铜前体组合物和溶剂的油墨可以沉积在基板上并烧结以产生金属铜膜。带有该膜的基板在电子器件中有用。
  • ANTISTATIC RESIN COMPOSITION AND POLYOLEFIN ANTISTATIC FIBER FOR CONTAINER AND PIPE FOR ORGANIC SOLVENT
    申请人:Adeka Corporation
    公开号:EP3279269A1
    公开(公告)日:2018-02-07
    Provided are: an antistatic resin composition for containers and pipes of organic solvents, which has long-lasting and sufficient antistaticity and whose antistatic performance is not impaired even when the composition is in contact with an organic solvent for a long period of time; and a container and a pipe for organic solvents, which include the same. The antistatic resin composition for containers and pipes of organic solvents contains 3 to 25 parts by mass of at least one polymer compound (E) with respect to 100 parts by mass of a thermoplastic resin, wherein the polymer compound (E) has a structure in which a diol, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, a compound (B) which includes at least one group represented by the following Formula (1) and has hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups are bound via ester bonds:
    本发明提供了:一种用于有机溶剂容器和管道的抗静电树脂组合物,该组合物具有持久和充分的抗静电性,即使该组合物与有机溶剂长时间接触,其抗静电性能也不会受到损害;以及一种有机溶剂容器和管道,其中包括该组合物。 用于有机溶剂容器和管道的抗静电树脂组合物含有至少一种聚合物化合物(E)(相对于 100 质量份的热塑性树脂),其质量份数为 3 至 25,其中聚合物化合物(E)具有二元醇结构、二元醇、脂肪族二羧酸、芳香族二羧酸、包含至少一个下式(1)所代表的基团且两端具有羟基的化合物(B)和具有两个或两个以上环氧基团的环氧化合物(D)通过酯键结合的结构:
  • Picene derivative, photoelectric material, and photoelectric device
    申请人:ADEKA CORPORATION
    公开号:US10074804B2
    公开(公告)日:2018-09-11
    The present invention provides: a p-type organic semiconductor material which is able to be produced easily, while having high planarity in a polymer skeleton; and a photoelectric conversion layer, a photoelectric conversion element and an organic thin film solar cell, each of which uses this p-type organic semiconductor material and has high photoelectric conversion efficiency. The present invention specifically provides: a picene derivative which has at least one constituent unit represented by general formula (1); and a photoelectric conversion element which contains (A) the picene derivative serving as a p-type organic semiconductor material and (B) an n-type organic semiconductor material. The details of general formula (1) are as set forth in the description.
    本发明提供了:一种易于生产,同时在聚合物骨架中具有高平面度的 p 型有机半导体材料;以及一种光电转换层、一种光电转换元件和一种有机薄膜太阳能电池,其中每一种都使用这种 p 型有机半导体材料,并且具有高光电转换效率。本发明具体提供了:一种具有通式(1)所代表的至少一个组成单元的苦皮烯衍生物;以及一种光电转换元件,其中包含(A)作为 p 型有机半导体材料的苦皮烯衍生物和(B)n 型有机半导体材料。通式(1)的详细内容见说明。
  • Antistatic resin composition and polyolefin antistatic fiber for container and pipe for organic solvent
    申请人:ADEKA CORPORATION
    公开号:US10308852B2
    公开(公告)日:2019-06-04
    Provided are: an antistatic resin composition for containers and pipes of organic solvents, which has long-lasting and sufficient antistaticity and whose antistatic performance is not impaired even when the composition is in contact with an organic solvent for a long period of time; and a container and a pipe for organic solvents, which include the same. The antistatic resin composition for containers and pipes of organic solvents contains 3 to 25 parts by mass of at least one polymer compound (E) with respect to 100 parts by mass of a thermoplastic resin, wherein the polymer compound (E) has a structure in which a diol, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, a compound (B) which includes at least one group represented by the following Formula (1) and has hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups are bound via ester bonds: —CH2—CH2—O—  (1).
    本发明提供了:一种用于有机溶剂容器和管道的抗静电树脂组合物,该组合物具有持久和充分的抗静电性,即使该组合物与有机溶剂长时间接触,其抗静电性能也不会受到损害;以及一种有机溶剂容器和管道,其中包括该组合物。 用于有机溶剂容器和管道的抗静电树脂组合物含有至少一种聚合物化合物(E)(相对于 100 质量份的热塑性树脂),其质量份数为 3 至 25,其中聚合物化合物(E)具有二元醇结构、二元醇、脂肪族二羧酸、芳香族二羧酸、包含至少一个下式(1)所代表的基团且两端具有羟基的化合物(B)和具有两个或两个以上环氧基团的环氧化合物(D)通过酯键结合的结构: -CH2-CH2-O-(1)。
  • Preparation of high conductivity copper films
    申请人:National Research Council of Canada
    公开号:US10954406B2
    公开(公告)日:2021-03-23
    A copper precursor composition contains: a first copper complex of an imine or a first cyclic amine coordinated to a first copper precursor compound; and, a second copper complex of a primary amine or a second cyclic amine coordinated to a second copper precursor compound. A copper precursor composition contains a copper complex of an imine coordinated to a copper precursor compound. The copper precursor composition is thermally degradable at a temperature lower than a comparable composition containing only primary amine copper complexes under otherwise the same conditions to produce a metallic copper film having a resistivity of about 200 μΩ-cm or less. Inks containing the copper precursor composition and a solvent may be deposited on a substrate and sintered to produce a metallic copper film. The substrate with the film thereon is useful in electronic devices.
    一种铜前体组合物含有:与第一种铜前体化合物配位的亚胺或第一环胺的第一铜络合物;以及与第二种铜前体化合物配位的伯胺或第二环胺的第二铜络合物。铜前体组合物含有与铜前体化合物配位的亚胺铜络合物。在其他条件相同的情况下,铜前体组合物的热降解温度低于仅含伯胺铜络合物的同类组合物,从而产生电阻率约为 200 μΩ-cm 或更小的金属铜膜。含有铜前驱体组合物和溶剂的油墨可沉积在基底上并烧结生成金属铜膜。带有薄膜的基底可用于电子设备。
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