A polyimide resin composition which produces a heat-conductive adhesive film having specifically satisfactory electrical insulation properties and thermal conductivity, exhibiting adhesiveness at a low temperature of about 170° C. to 200° C., and exhibiting a glass transition temperature of higher than 200° C. after lamination of the film, is provided. Disclosed is a resin composition including an aromatic polyimide resin (A) containing phenolic hydroxyl groups; a filler (B); and an epoxy resin (C) having a melt viscosity of 0.04 Pa·s or less, wherein the ratio of the amounts in parts by mass of the polyimide resin (A), the filler (B), and the epoxy resin (C) satisfies the relationships: (A):(C)=99:1 to 1:99, and ((A)+(C)):(B)=80:20 to 5:95.
                            提供了一种聚
酰亚胺树脂组合物,该组合物可以生产出具有特别满意的电绝缘性能和导热性能的导热粘合膜,该粘合膜在约170°C至200°C的低温下具有粘附性,并在膜层压后具有高于200°C的
玻璃化转变温度。所披露的
树脂组合物包括含有
酚羟基的芳香族聚
酰亚胺树脂(A)、填料(B)和具有熔融粘度为0.04 Pa·s或更低的环氧
树脂(C),其中聚
酰亚胺树脂(A)、填料(B)和环氧
树脂(C)的质量比满足以下关系:(A):(C)=99:1至1:99,且((A)+(C)):(B)=80:20至5:95。