Provided are a photosensitive composition for pulse exposure including: a coloring material A; a photoradical polymerization initiator B; and a radically polymerizable compound C, in which a content of a radically polymerizable compound C1 having a weight-average molecular weight of 3000 or higher is 70 mass % or higher with respect to a total mass of the radically polymerizable compound C.
US9086623B2
申请人:——
公开号:US9086623B2
公开(公告)日:2015-07-21
[EN] PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PLATED MOLDED ARTICLE, AND SEMICONDUCTOR APPARATUS<br/>[FR] COMPOSITION DE RÉSINE PHOTOSENSIBLE, PROCÉDÉ DE FORMATION D'UN MOTIF DE RÉSERVE, PROCÉDÉ DE FABRICATION D'UN ARTICLE MOULÉ PLAQUÉ, ET APPAREIL À SEMI-CONDUCTEUR<br/>[JA] 感光樹脂組成物、レジストパターンの形成方法、メッキ造形物の製造方法および半導体装置