Diisoamyl tartrate | 608-86-6

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羟基酸及其衍生物
• 英文名称: Diisoamyl tartrate
• 英文别名: bis(3-methylbutyl) 2,3-dihydroxybutanedioate
• CAS: 608-86-6
• 化学式: C₁₄H₂₆O₆
• 分子量: 290.35
• InChiKey: VOBHVQRBBHSZAZ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.4
• 重原子数：
  20
• 可旋转键数：
  11
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.86
• 拓扑面积：
  93.1
• 氢给体数：
  2
• 氢受体数：
  6

文献信息

• Process solutions containing surfactants
  申请人：AIR PRODUCTS AND CHEMICALS, INC.

  公开号：EP1389746A2

  公开（公告）日：2004-02-18

  Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce post-development defects such as pattern collapse when employed as a rinse solution either during or after the development of the patterned photoresist layer. Also disclosed is a method for reducing the number of pattern collapse defects on a plurality of photoresist coated substrates employing the process solution of the present invention.

  包含一种或多种表面活性剂的工艺溶液用于减少半导体器件制造过程中的缺陷数量。在某些优选的实施方案中，本发明的工艺溶液在图案化光刻胶层显影期间或之后用作冲洗溶液时，可减少显影后缺陷，如图案塌陷。本发明还公开了一种采用本发明工艺溶液减少多个光刻胶涂层基底上图案塌陷缺陷数量的方法。
• Process solutions containing surfactants used as post-chemical mechanical planarization treatment
  申请人：AIR PRODUCTS AND CHEMICALS, INC.

  公开号：EP1530232A2

  公开（公告）日：2005-05-11

  Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse solution either during or after the development of the CMP processing. Also disclosed is a method for reducing the number of defects on a plurality of post-CMP processed substrates employing the process solution of the present invention.

  包含一种或多种表面活性剂的工艺溶液用于减少半导体器件制造过程中的缺陷数量。在某些优选的实施方案中，本发明的工艺溶液在 CMP 加工过程中或加工后作为冲洗溶液使用时，可减少缺陷。此外，还公开了一种采用本发明工艺溶液减少经 CMP 处理后的多个基板上缺陷数量的方法。
• Compositions and methods using same for flowable oxide deposition
  申请人：AIR PRODUCTS AND CHEMICALS, INC.

  公开号：US10170297B2

  公开（公告）日：2019-01-01

  Described herein are compositions or formulations for forming a film in a semiconductor deposition process, such as without limitation, a flowable chemical vapor deposition of silicon oxide. Also described herein is a method to improve the surface wetting by incorporating an acetylenic alcohol or diol surfactant such as without limitation 3,5-dimethyl-1-hexyn-3-ol, 2,4,7,9-tetramethyl-5-decyn-4,7-diol, 4-ethyl-1-octyn-3-ol, and 2,5-dimethylhexan-2,5-diol, and other related compounds.

  本文描述了用于在半导体沉积工艺中形成薄膜的组合物或配方，例如但不限于氧化硅的可流动化学气相沉积。本文还描述了一种通过加入乙炔醇或二元醇表面活性剂（如但不限于 3,5-二甲基-1-己炔-3-醇、2,4,7,9-四甲基-5-癸炔-4,7-二醇、4-乙基-1-辛炔-3-醇和 2,5-二甲基己-2,5-二醇及其他相关化合物）来改善表面润湿性的方法。
• Ink composition
  申请人：Hewlett-Packard Development Company, L.P.

  公开号：US10273375B2

  公开（公告）日：2019-04-30

  An ink composition includes colorant, co-solvent system, acid (e.g., oleic, linoleic, undecanoic, dodecanoic, and/or tridecanoic acids), lithium, polymer as binder, and water. The co-solvent system is selected from i) from ˜9 to ˜25 wt % of sulfolane with no other co-solvent, ii) hydroxylated co-solvent, from ˜4 to ˜16 wt % of sulfolane, and at least 8 wt % of another non-hy-droxylated co-solvent; iii) hydroxylated co-solvent, from ˜7 to ˜16 wt % of sulfolane, and at least 3 wt % of the other non-hydroxylated co-solvent; and iv) a hydroxylated co-solvent and from ˜9 wt % to ˜16 wt % of sulfolane. When i) or ii) or iv) is used, at least 0.15 wt % acid and at least 200 ppm lithium are included; or when iii) is used, at least 0.25 wt % acid and at least 100 ppm lithium are included; or when iii) is used, at least 0.15 wt % acid and at least 150 ppm lithium are included.

  油墨组合物包括着色剂、助溶剂系统、酸（如油酸、亚油酸、十一烷酸、十二烷酸和/或十三烷酸）、锂、作为粘合剂的聚合物和水。助溶剂体系选自 i) 9 至 25 wt % 的磺丙烷，不含其它助溶剂；ii) 羟基化助溶剂，4 至 16 wt % 的磺丙烷和至少 8 wt % 的其它非羟基化助溶剂；iii) 羟基化助溶剂、重量百分比为 7 至 16 的磺丙烷和重量百分比至少为 3 的另一种非羟基化助溶剂；以及 iv) 羟基化助溶剂和重量百分比为 9 至 16 的磺丙烷。当使用 i) 或 ii) 或 iv) 时，至少包括 0.15 wt % 的酸和至少 200 ppm 的锂；或当使用 iii) 时，至少包括 0.25 wt % 的酸和至少 100 ppm 的锂；或当使用 iii) 时，至少包括 0.15 wt % 的酸和至少 150 ppm 的锂。
• Inkjet printing systems
  申请人：Hewlett-Packard Development Company, L.P.

  公开号：US11066566B2

  公开（公告）日：2021-07-20

  The present disclosure is drawn to an inkjet printing system including an ink composition and a microfluidic ejection assembly. The ink composition can include carbon black pigment, from 50 wt % to 80 wt % water, from 10 wt % to 40 wt % of an organic solvent system, and from 0.5 wt % to 6 wt % polyurethane. The microfluidic ejection assembly can include a drop generator for externally ejecting the ink composition, and a fluid pump for internally inducing microfluidic recirculation flow of the ink composition into the drop generator.

  本公开涉及一种喷墨打印系统，包括墨水组合物和微流体喷射组件。墨水组合物可包括碳黑颜料、50 重量 % 至 80 重量 % 的水、10 重量 % 至 40 重量 % 的有机溶剂系统和 0.5 重量 % 至 6 重量 % 的聚氨酯。微流体喷射组件可包括一个用于从外部喷射油墨组合物的液滴发生器，以及一个用于从内部将油墨组合物的微流体再循环流引入液滴发生器的流体泵。

表征谱图