2-benzyldiphenylsulfide | 137156-17-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2-benzyldiphenylsulfide
• 英文别名: 1-Benzyl-2-phenylsulfanylbenzene
• CAS: 137156-17-3
• 化学式: C₁₉H₁₆S
• 分子量: 276.402
• InChiKey: LFLYUSSDKZXXBV-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.9
• 重原子数：
  20
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.05
• 拓扑面积：
  25.3
• 氢给体数：
  0
• 氢受体数：
  1

反应信息

• 作为产物：
  描述：

  二苯硫醚 在 silver tetrafluoroborate 作用下， 以 乙醚 、 二氯甲烷 为溶剂， 反应 14.0h， 生成 2-benzyldiphenylsulfide
  参考文献：
  名称：

  Biomimetic transalkylation of olefins via sulfonium salts

  摘要：

  The biomimetic transalkylation of 2-methyl-2-octene utilizing alkyl sulfonium salts is discussed in terms of the structure of the salt and the nature of the alkyl group.

  DOI：

  10.1016/s0040-4020(01)96149-6

文献信息

• ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE COMPOSITION, AND RESIST FILM, RESIST-COATED MASK BLANKS, RESIST PATTERN FORMING METHOD AND PHOTOMASK EACH USING THE COMPOSITION
  申请人：FUJIFILM CORPORATION

  公开号：US20150010855A1

  公开（公告）日：2015-01-08

  There is provided an actinic ray-sensitive or radiation-sensitive composition containing (α) a compound represented by the formula (αI) capable of generating an acid having a size of 200 Å 3 or more in volume and (β) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and the formula (αI) is defined as herein, and a resist film formed using the actinic ray-sensitive or radiation-sensitive composition, a resist-coated mask blanks coated with the resist film, a resist pattern forming method comprising exposing the resist film and developing the exposed film, a photomask obtained by exposing and developing the resist-coated mask blanks, a method for manufacturing an electronic device, comprising the resist pattern forming method and an electronic device manufactured by the manufacturing method of an electronic device.

  提供一种感光或辐射敏感的组合物，其中包含(α)一种化合物，其由公式(αI)表示，能够产生大小为200Å3或更大的体积的酸，以及(β)一种化合物，能够在受到光辐射或辐射时产生酸，公式(αI)的定义如本文所述。还提供了使用该感光或辐射敏感组合物形成的光阻膜，涂有光阻膜的光阻涂层掩模坯料，包括曝光光阻膜和显影曝光后膜的光阻图案形成方法，通过曝光和显影涂有光阻涂层的掩模坯料获得的光掩模，以及一种电子器件的制造方法，包括光阻图案形成方法和制造电子器件的电子器件制造方法，以及通过该电子器件制造方法制造的电子器件。
• ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM USING THE SAME, PATTERN FORMING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE AND RESIN
  申请人：FUJIFILM Corporation

  公开号：US20150132688A1

  公开（公告）日：2015-05-14

  There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising (P) a resin having (a) a repeating unit represented by the specific formula; a resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition; a pattern forming method comprising (i) a step of forming a film by using the actinic ray-sensitive or radiation-sensitive resin composition, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using a developer to form a pattern; a method for manufacturing an electronic device, comprising the pattern forming method; and an electronic device manufactured by the manufacturing method of an electronic device.

  提供了一种光致射线敏感或辐射敏感的树脂组合物，其中包括（P）具有（a）由特定公式表示的重复单元的树脂；使用该光致射线敏感或辐射敏感的树脂组合物形成的抗蚀膜；包括（i）使用该光致射线敏感或辐射敏感的树脂组合物形成膜的步骤，（ii）曝光膜的步骤，以及（iii）使用显影剂显影曝光的膜以形成图案的图案形成方法；一种制造电子设备的方法，包括图案形成方法；以及通过电子设备的制造方法制造的电子设备。
• ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THE SAME, AND ELECTRONIC DEVICE
  申请人：FUJIFILM CORPORATION

  公开号：US20150185612A1

  公开（公告）日：2015-07-02

  There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising: (A) a resin having a repeating unit represented by the specific formula and a group capable of decomposing by an action of an acid to produce a polar group; and an ionic compound represented by the specific formula, and a resist film comprising the actinic ray-sensitive or radiation-sensitive resin composition.

  提供一种光致射线敏感或辐射敏感的树脂组合物，包括：（A）具有特定公式表示的重复单元和能够通过酸作用分解产生极性基团的基团的树脂；以及具有特定公式表示的离子化合物，以及包括该光致射线敏感或辐射敏感的树脂组合物的抗蚀膜。
• PATTERN FORMING METHOD, COMPOSITION KIT AND RESIST FILM, AND METHOD FOR PRODUCING ELECTRONIC DEVICE USING THEM, AND ELECTRONIC DEVICE
  申请人：FUJIFILM CORPORATION

  公开号：US20160018734A1

  公开（公告）日：2016-01-21

  There is provided a pattern forming method comprising (a) a step of forming a film on a substrate using an electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition, (b) a step of forming a top coat layer on the film using a top coat composition containing a resin (T) containing at least any one of repeating units represented by formulae (I-1) to (I-5) shown below, (c) a step of exposing the film having the top coat layer using an electron beam or an extreme ultraviolet radiation, and (d) a step of developing the film having the top coat layer after the exposure to form a pattern.

  提供了一种图案形成方法，包括以下步骤：(a)使用电子束敏感或极紫外辐射敏感的树脂组合物在基板上形成薄膜的步骤，(b)使用含有至少一个由下式(I-1)到(I-5)中所示的重复单元表示的树脂(T)的顶层涂料组成的顶层涂料层的形成步骤，(c)使用电子束或极紫外辐射照射具有顶层涂料层的薄膜的步骤，以及(d)在照射后开发具有顶层涂料层的薄膜以形成图案的步骤。
• Adhesive sheet for wafer and process for preparing semiconductor apparatus using the same
  申请人：TEXAS INSTRUMENTS INCORPORATED

  公开号：EP0622833A1

  公开（公告）日：1994-11-02

  Disclosed is an adhesive sheet for wafer comprising a substrate film (2) and a radiation curable adhesive layer (3) formed thereon, said adhesive sheet being used in a process for preparing a semiconductor device comprising the steps of adhering a back surface of a wafer (A), a front surface of which has been formed a circuit, onto the radiation curable adhesive layer, dicing the wafer into chips (A₁,A₂,...), rinsing, drying, irradiating the adhesive layer with radiation (B) to cure said adhesive layer, expanding the adhesive sheet if necessary to make the chips apart from each other, then picking up the chips, mounting the picked chips on a lead frame, bonding, and molding to give such a structure that the back surfaces of the chips are partially or wholly in contact with a package molding resin, wherein the radiation curable adhesive layer comprises 100 parts by weight of an acrylic adhesive composed of a copolymer of an acrylic ester and an OH group-containing polymerizable monomer and 50 - 200 parts by weight of a radiation polymerizable compound having two or more unsaturated bonds, and the radiation curable adhesive layer has an elastic modulus of not less than 1 × 10⁹dyn/cm² after curing by irradiation with radiation.

  本发明公开了一种用于晶片的粘合片，包括基底薄膜 (2) 和在其上形成的辐射固化粘合层 (3)，所述粘合片用于制备半导体器件的工艺中，该工艺包括以下步骤：将晶片 (A) 的背面（其正面已形成电路）粘合到辐射固化粘合层上，将晶片切割成芯片 (A₁、A₂、......)，冲洗，干燥，用辐射 (B) 照射粘合层以固化所述粘合层，必要时展开粘合片使芯片彼此分开，然后拾取被拾取的芯片 (A₁、A₂、......)。) ，冲洗，烘干，用辐射（B）照射粘合剂层以固化所述粘合剂层，必要时扩大粘合剂片以使芯片彼此分开，然后拾取芯片，将拾取的芯片安装在引线框架上，粘合，成型，使芯片的背面部分或全部与封装成型树脂接触、其中，辐射固化粘合剂层包括 100 份（按重量计）由丙烯酸酯和含羟基可聚合单体的共聚物组成的丙烯酸粘合剂和 50 - 200 份（按重量计）具有两个或两个以上不饱和键的辐射可聚合化合物，并且辐射固化粘合剂层在通过辐射照射固化后具有不小于 1 × 10⁹dyn/cm²的弹性模量。