4-Brom-2-n-dodecyl-4-isothiazolin-3-on | 64359-73-5

• 分子结构分类: 有机化合物 - 有机卤素化合物 - 芳基卤化物
• 英文名称: 4-Brom-2-n-dodecyl-4-isothiazolin-3-on
• 英文别名: 4-bromo-2-dodecyl-isothiazol-3-one；4-Bromo-2-dodecyl-1,2-thiazol-3-one
• CAS: 64359-73-5
• 化学式: C₁₅H₂₆BrNOS
• 分子量: 348.348
• InChiKey: DMVCQXVCUBGZNF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.5
• 重原子数：
  19
• 可旋转键数：
  11
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.8
• 拓扑面积：
  45.6
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  4-Brom-2-n-dodecyl-4-isothiazolin-3-on 在 溴 作用下， 以 乙酸乙酯 、 N,N-二甲基甲酰胺 为溶剂， 生成 4,5-Dibrom-2-n-dodecyl-4-isothiazolin-3-on
  参考文献：
  名称：

  Weiler,E.D. et al., Journal of Heterocyclic Chemistry, 1977, vol. 14, p. 627 - 630

  摘要：

  DOI：
• 作为产物：
  描述：

  2-dodecyl-isothiazol-3-one 在 溴 作用下， 生成 4-Brom-2-n-dodecyl-4-isothiazolin-3-on
  参考文献：
  名称：

  Weiler,E.D. et al., Journal of Heterocyclic Chemistry, 1977, vol. 14, p. 627 - 630

  摘要：

  DOI：

文献信息

• Aqueous dispersion for chemical mechanical polishing
  申请人：JSR Corporation

  公开号：EP1357161A2

  公开（公告）日：2003-10-29

  The invention provides an aqueous dispersion for chemical mechanical polishing that is hard to putrefy, scarcely causes scratches, causes only small dishing and is suitable for used in a micro isolating step or a planarizing step of an inter layer dielectric in production of semiconductor devices. The aqueous dispersion for chemical mechanical polishing comprises ceria particles, a preservative composed of a compound having a heterocyclic structure containing a nitrogen atom and a sulfur atom in the ring, such as an isothiazolone compound, and an organic component such as organic abrasive grains composed of resin particles, a dispersing agent composed of a water-soluble polymer having a specific molecular weight or the like, a surfactant and/or an organic acid or a salt thereof contained in an aqueous medium. The ceria particles, preservative and organic component are contained in proportions of 0.1 to 20 % by mass, 0.001 to 0.2 % by mass and 0.1 to 30 % by mass, respectively, when the total proportion of the aqueous medium, ceria particles, preservative and organic component is 100 % by mass. The pH of this aqueous dispersion can be kept in a neutral range.

  本发明提供了一种用于化学机械抛光的水性分散液，该分散液不易腐化，几乎不会造成划痕，仅会引起微小的凹凸不平，适用于半导体器件生产中层间电介质的微隔离步骤或平面化步骤。 用于化学机械抛光的水性分散液包括铈颗粒、由具有杂环结构的化合物组成的防腐剂，该化合物在环中含有一个氮原子和一个硫原子，例如异噻唑酮化合物；以及有机成分，例如由树脂颗粒组成的有机磨粒、由具有特定分子量的水溶性聚合物或类似物组成的分散剂、表面活性剂和/或有机酸或其在水性介质中的盐。当水介质、铈颗粒、防腐剂和有机成分的总比例为 100%时，铈颗粒、防腐剂和有机成分的质量比例分别为 0.1%至 20%、0.001%至 0.2%和 0.1%至 30%。该水分散液的 pH 值可保持在中性范围内。
• AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, AND KIT FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING
  申请人：JSR Corporation

  公开号：EP1962334A1

  公开（公告）日：2008-08-27

  A chemical mechanical polishing aqueous dispersion includes (A) abrasive grains having a pore volume of 0.14 ml/g or more, and (B) a dispersion medium.

  一种化学机械抛光水性分散液包括 (A) 孔隙度为 0.14 毫升/克或更大的研磨粒和 (B) 一种分散介质。
• WEILER E. D.; PETIGARA R. B.; WOLFERSBERGER M. H.; MILLER G. A., J. HETEROCYCL. CHEM. <JHTC-AD>, 1977, 14, NO 4, 627-630
  作者：WEILER E. D.、 PETIGARA R. B.、 WOLFERSBERGER M. H.、 MILLER G. A.

  DOI：——

  日期：——
• CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION, CHEMICAL MECHANICAL POLISHING METHOD, AND KIT FOR PREPARING CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION
  申请人：Ikeda Norihiko

  公开号：US20090165395A1

  公开（公告）日：2009-07-02

  A chemical mechanical polishing aqueous dispersion includes (A) abrasive grains having a pore volume of 0.14 ml/g or more, and (B) a dispersion medium.
• AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, PRODUCTION METHOD THEREOF, AND CHEMICAL MECHANICAL POLISHING METHOD
  申请人：Ueno Tomikazu

  公开号：US20090325323A1

  公开（公告）日：2009-12-31

  There is provided an aqueous dispersion for chemical mechanical polishing that comprises abrasives comprising: (A) 100 parts by weight of inorganic particles comprising ceria, (B) 5 to 100 parts by weight of cationic organic polymer particles, and (C) 5 to 120 parts by weight of anionic water-soluble compound. The aqueous dispersion for chemical mechanical polishing is preferably produced by a method comprising a step of adding a second liquid comprising (C) 5 to 30 wt % of anionic water-soluble compound to a first liquid comprising (A) 0.1 to 10 wt % of inorganic particles comprising ceria and (B) 5 to 100 parts by weight of cationic organic polymer particles based on 100 parts by weight of the inorganic particles (A).