申请人:Tokyo Ohka Kogyo Co., Ltd.
公开号:US20030032280A1
公开(公告)日:2003-02-13
A method for filling a fine hole, having a hole pattern diameter of less than or equal to 0.18 &mgr;m, comprising the following steps of: (i) filling the fine hole with filler which is obtained by dissolving into an organic solvent a nitrogen-containing compound having mean molecular weight of less than or equal to 800 and containing at least one kind selected from melamine, benzoguanamine, acetoguanamine, glycol uryl, urea, thiourea, guanidine, alkyleneurea and succinylamide, in which hydrogen atoms of amino groups are substituted by at least one of hydroxyalkyl groups and alkoxyalkyl groups or both of the groups; (ii) drying the filler; and (iii) heating said filler at a temperature of 150-250° C., whereby no bubble is generated when the fine hole is filled.
一种填充细孔的方法,其孔型直径小于或等于 0.18 &mgr;m,包括以下步骤:(i) 用填料填充细孔,该填料是通过将平均分子量小于或等于 800 的含氮化合物溶解到有机溶剂中得到的,该化合物含有至少一种选自三聚氰胺、苯并胍胺、乙酰胍胺、乙二醇尿素、脲、硫脲、胍、亚烷基脲和琥珀酰氨的基团,其中氨基的氢原子被羟基烷基和烷氧基烷基中的至少一个基团或这两个基团取代;(iii) 在 150-250°C 的温度下加热所述填料。,从而在填充细孔时不会产生气泡。