Triaethyl-phosphorothiolat, Triaethylthiophosphit | 36061-67-3

• 分子结构分类: 有机化合物 - 有机磷化合物 - 有机硫代磷化合物
• 英文名称: Triaethyl-phosphorothiolat, Triaethylthiophosphit
• 英文别名: O.O.S-Triaethyl-phosphorthiolat；thiophosphorous acid triethyl ester；thiophosphoric acid triethyl ester；Triaethylthiophosphit；Monothiophosphorigsaeure-triaethylester；Thiophosphorigsaeure-triaethylester；O,O,S-Triethyl phosphorothioite；diethoxy(ethylsulfanyl)phosphane
• CAS: 36061-67-3
• 化学式: C₆H₁₅O₂PS
• 分子量: 182.224
• InChiKey: DMDSLMWVIMKDQA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.6
• 重原子数：
  10
• 可旋转键数：
  6
• 环数：
  0.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  43.8
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  Triaethyl-phosphorothiolat, Triaethylthiophosphit 、 Diethyl azidophosphate 以 乙醚 为溶剂， 生成 diethoxyphosphoryl-thiophosphorimidic acid triethyl ester
  参考文献：
  名称：

  Khodak,A.A. et al., Journal of general chemistry of the USSR, 1974, vol. 44, p. 241 - 245

  摘要：

  DOI：
• 作为产物：
  描述：

  二乙基亚磷酰氯 、 乙硫醇钠 生成 Triaethyl-phosphorothiolat, Triaethylthiophosphit
  参考文献：
  名称：

  Arbusow; Nikonorow, Doklady Akademii Nauk SSSR, 1948, vol. 62, p. 75

  摘要：

  DOI：

文献信息

• Phosphorus-sulfur based antifoulants
  申请人：NALCO/EXXON ENERGY CHEMICALS L.P.

  公开号：EP1085074A2

  公开（公告）日：2001-03-21

  This invention is directed to a method of inhibiting fouling of heat transfer surfaces in contact with petroleum or hydrocarbon feedstocks comprising contacting the heat transfer surfaces with an effective amount of a thermally-treated phosphorous-sulfur compound and to methods and apparatus for preparing and contacting the thermally-treated phosphorous-sulfur compounds with the heat transfer surfaces.

  本发明涉及一种抑制与石油或烃类原料接触的传热表面结垢的方法，包括使传热表面与有效量的热处理磷硫化合物接触，以及制备热处理磷硫化合物并使其与传热表面接触的方法和装置。
• Epoxy resin encapsulation compositions
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP1285938A1

  公开（公告）日：2003-02-26

  Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant (11) may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

  已公开的环氧树脂组合物包括：(A) 至少一种环脂族环氧树脂；(B) 由六氢-4-甲基邻苯二甲酸酐组成的固化剂；(C) 至少一种基本上不含卤素的含硼催化剂；(D) 至少一种固化改性剂。 封装剂 (11) 还可选择包含辅助固化催化剂、热稳定剂、紫外线稳定剂、偶联剂或折射率改性剂中的至少一种。 还公开了封装固态器件，包括封装、芯片（4）和由本发明环氧树脂组合物组成的封装剂（11）。 还提供了一种封装固态器件的方法。
• Epoxy resin compositions and solid state devices encapsulated therewith
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP1285939A1

  公开（公告）日：2003-02-26

  Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant (11) may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

  已公开的环氧树脂组合物包括：(A) 至少一种环脂族环氧树脂；(B) 至少一种酸酐固化剂；(C) 至少一种基本上不含卤素的含硼催化剂；(D) 至少一种固化改性剂；以及(E) 可选的至少一种辅助固化催化剂。封装剂 (11) 还可选择包含热稳定剂、紫外线稳定剂、偶联剂或折射率改性剂中的至少一种。还公开了封装固态器件，包括封装、芯片（4）和由本发明环氧树脂组合物组成的封装剂（11）。还提供了一种封装固态器件的方法。
• Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP1408087A1

  公开（公告）日：2004-04-14

  Epoxy resin compositions are disclosed which comprise (A) at least one silicone resin, (B) at least one epoxy resin, (C) at least one anhydride curing agent, (D) at least one siloxane surfactant, and (E) at least one ancillary curing catalyst. Also disclosed are a packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising a composition of the invention. A method of encapsulating a solid state device is also provided.

  本发明公开了环氧树脂组合物，其中包括 (A) 至少一种硅树脂、(B) 至少一种环氧树脂、(C) 至少一种酸酐固化剂、(D) 至少一种硅氧烷表面活性剂和 (E) 至少一种辅助固化催化剂。还公开了一种封装固态器件，包括封装、芯片（4）和包含本发明组合物的封装剂（11）。还提供了一种封装固态器件的方法。
• Cationically cross-linkable/polymerizable composition comprising an iodonium borate and releasing an acceptable odor
  申请人：ELKEM SILICONES FRANCE SAS

  公开号：US10131817B2

  公开（公告）日：2018-11-20

  A photoinitiator composition is described that includes a specific iodonium salt combined with a hydrogen donor that is a Guerbet alcohol that can also act as a solvent. This initiator system can solve problems concerning odor, in particular after the polymerization/cross-linking of conventional iodonium salts.

  本文介绍了一种光引发剂组合物，它包括一种特定的碘盐和一种氢供体，氢供体是一种也可用作溶剂的格尔伯特醇。这种引发剂体系可以解决气味问题，尤其是在传统碘盐聚合/交联之后。