An epoxy resin composition useful in an electrical laminate, which composition comprises:
(A) an epoxy resin prepared by reacting (A-1) an epoxy resin having an average of more than one, but less than three epoxy groups per molecule and (A-2) a phenolic compound having an average of more than one, but less than three hydroxyl groups per molecule at a ratio to provide an epoxy to phenolic equivalent ratio of 1:x;
(B) y equivalent of a phenolic compound having an average of more than one, but less than three hydroxyl groups per molecule; and
(C) at least one catalyst for catalyzing a reaction of Component (A) and Component (B);
wherein x and y satisfy the following equations:
x ≧ 0.01 y ≧ 0.01
0.02 ≦ x + y < 1.00.
The disclosed epoxy resin composition, exhibits low viscosity when dissolved in an organic solvent and good heat resistance when cured.
一种可用于电气层压板的环氧
树脂组合物,该组合物包括
(A) 环氧
树脂,其制备方法是:(A-1) 每分子平均具有一个以上但少于三个环氧基团的环氧
树脂与(A-2) 每分子平均具有一个以上但少于三个羟基基团的
酚类化合物按一定比例反应,使环氧
树脂与
酚类化合物的当量比为 1:x;
(B) y 个当量的
酚类化合物,其平均每个分子具有一个以上但少于三个羟基;以及
(C) 至少一种催化剂,用于催化组分(A)和组分(B)的反应;
其中 x 和 y 满足以下公式:
x ≧ 0.01 y ≧ 0.01
0.02 ≦ x + y < 1.00。
所公开的环氧
树脂组合物溶于有机溶剂时粘度低,固化时耐热性好。