(4-benzoylphenyl)(p-tolyl)methanone | 69677-75-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: (4-benzoylphenyl)(p-tolyl)methanone
• 英文别名: [4-(4-Methylbenzoyl)phenyl]-phenylmethanone
• CAS: 69677-75-4
• 化学式: C₂₁H₁₆O₂
• 分子量: 300.357
• InChiKey: FPBUKYMLBDTKET-UHFFFAOYSA-N

物化性质

• 沸点：
  483.3±28.0 °C(Predicted)
• 密度：
  1.146±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  5.1
• 重原子数：
  23
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.05
• 拓扑面积：
  34.1
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  对氰基苯甲酰氯 在 三乙胺 作用下， 以 四氢呋喃 、 二氯甲烷 为溶剂， 反应 29.0h， 生成 (4-benzoylphenyl)(p-tolyl)methanone
  参考文献：
  名称：

  将格氏试剂添加到含有腈和 Weinreb 酰胺官能团的底物中的化学选择性研究

  摘要：

  已经合成了几种含有氰基和 Weinreb 酰胺官能团的底物，以研究它们与有机溴化镁（ArMgBr 和 RMgBr）反应的化学选择性。在大多数情况下观察到对 Weinreb 酰胺的优异化学选择性，即使在过量格氏试剂存在的情况下，也能以良好到优异的产率提供氰基酮。

  DOI：

  10.1002/ejoc.201300622

文献信息

• TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20180120702A1

  公开（公告）日：2018-05-03

  The present invention provides a tetracarboxylic acid diester compound represented by the following general formula (1), wherein, X 1 represents a tetravalent organic group, and R 1 represents a group represented by the following general formula (2), wherein, the dotted line represents a bonding, Y 1 represents an organic group with a valency of k+1, Rs represents a group containing at least one silicon atom, “k” represents 1, 2 or 3, and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound which can lead a polymer of a polyimide precursor capable of using a base resin of a negative photosensitive resin composition which is capable of forming a fine pattern and giving high resolution, a polymer of a polyimide precursor obtained by using the tetracarboxylic acid diester compound and a method for producing the same.

  本发明提供了一种四羧酸二酯化合物，其表示为以下通式（1）：其中，X1表示四价有机基团，R1表示以下通式（2）所表示的基团：其中，虚线表示键合，Y1表示具有k+1价的有机基团，Rs表示含有至少一个硅原子的基团，“k”表示1、2或3，“n”表示0或1。可以提供一种四羧酸二酯化合物，该化合物能够引导聚合物的形成，该聚合物是由使用负光敏树脂组合物的基树脂制成的，该组合物能够形成细微图案并具有高分辨率，使用四羧酸二酯化合物制得的聚酰亚胺前体聚合物以及其制备方法。
• POLYAMIC ACID ESTER
  申请人：Asahi Kasei Kabushiki Kaisha

  公开号：EP1219662A1

  公开（公告）日：2002-07-03

  Disclosed is a polyamide ester which comprises a plurality of specific amide ester recurring units including, in a specific ratio, recurring units containing a tetravalent benzene group and recurring units containing a tetravalent diphenyl ether group, and which is adapted to be converted to a polyimide in a coating form by heat-curing, wherein the polyimide coating exhibits a residual stress of 33 MPa or less as measured with respect to a 10 µm-thick polyimide coating formed on a silicon substrate. Also disclosed is a polyamide ester composition comprising a plurality of different polyamide esters, wherein the plurality of different polyamide esters collectively contain, in a specific ratio, the recurring units containing a tetravalent benzene group and the recurring units containing a tetravalent diphenyl ether group.

  公开了一种聚酰胺酯，该聚酰胺酯包含多个特定的酰胺酯递归单元，其中按特定比例包含含有四价苯基团的递归单元和含有四价二苯醚基团的递归单元，该聚酰胺酯可通过热固化转化为涂层形式的聚酰亚胺，其中聚酰亚胺涂层相对于在硅基底上形成的 10 微米厚聚酰亚胺涂层而言，显示出 33 兆帕或更小的残余应力。本发明还公开了一种聚酰胺酯组合物，该组合物包含多种不同的聚酰胺酯，其中多种不同的聚酰胺酯以特定比例共同包含含有四价苯基的递归单元和含有四价二苯醚基的递归单元。
• HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
  申请人：Asahi Kasei EMD Corporation

  公开号：EP1536286A1

  公开（公告）日：2005-06-01

  Disclosed is a negative type photosensitive resin composition comprising (A) a polyamide having a photopolymerizable unsaturated double bond, (B) a monomer having a photopolymerizable unsaturated double bond, (C) a photopolymerization initiator and (D) a melamine resin.

  本发明公开了一种负型感光树脂组合物，该组合物包括：(A) 具有可进行光聚合的不饱和双键的聚酰胺；(B) 具有可进行光聚合的不饱和双键的单体；(C) 光聚合引发剂；(D) 三聚氰胺树脂。
• POLYAMIDE
  申请人：Asahi Kasei EMD Corporation

  公开号：EP1775316A1

  公开（公告）日：2007-04-18

  A polyamide having a structure represented by the chemical formula (1): wherein m and n represent an integer satisfying m≥1, n≥1, 2≤(m+n)≤150, 0.3≤m/(m+n)≤0.9, R1 and R2 represent at least one monovalent organic group containing a photopolymerizable unsaturated bond, X1 represents at least one tetravalent aromatic group, X2 represents at least one trivalent aromatic group, Y1 and Y2 represent at least one divalent organic group, and Z represents at least one monovalent organic group selected from mono-substituted amino and imido groups.

  一种聚酰胺，其结构由化学式（1）表示： 其中 m 和 n 代表满足 m≥1, n≥1, 2≤(m+n)≤150, 0.3≤m/(m+n)≤0.9、R1 和 R2 代表至少一个含有可光聚合不饱和键的一价有机基团，X1 代表至少一个四价芳香基团，X2 代表至少一个三价芳香基团，Y1 和 Y2 代表至少一个二价有机基团，Z 代表至少一个选自单取代氨基和亚氨基的一价有机基团。
• POLYORGANOSILOXANE COMPOSITION
  申请人：Asahi Kasei Corporation

  公开号：EP2067800A1

  公开（公告）日：2009-06-10

  Disclosed is a polyorganosiloxane composition containing the following components (a)-(c). (a) 100 parts by mass of a polyorganosiloxane obtained by mixing at least one silanol compound represented by the general formula (1) below, at least one alkoxysilane compound represented by the general formula (2) below, and at least one catalyst selected from the group consisting of compounds represented by the general formula (3) below, compounds represented by the general formula (4) below and Ba(OH)2, and polymerizing the mixture without actively adding water thereinto [chemical formula 1] R2Si(OH)2 (1) [chemical formula 2] R'Si(OR")3 (2) (chemical formula 3] M(OR''')4 (3) [chemical formula 4] M'(OR'''')3 (4) (b) 0.1-20 parts by mass of a photopolymerization initiator (c) 1-100 parts by mass of a compound other than the component (a) having two or more photopolymerizable unsaturated bonding groups.

  本发明公开了一种含有以下成分(a)-(c)的聚有机硅氧烷组合物。(a) 100 重量份的聚有机硅氧烷，该聚有机硅氧烷是通过混合至少一种如下通式 (1) 所代表的硅烷醇化合物、至少一种如下通式 (2) 所代表的烷氧基硅烷化合物和至少一种选自由如下通式 (3) 所代表的化合物组成的催化剂组、R2Si(OH)2 (1) [化学式 2] R'Si(OR")3 (2) （化学式 3M(OR''')4 (3) [化学式 4] M'(OR'''')3 (4) (b) 0.1-20 份（质量份）光聚合引发剂 (c) 1-100 份（质量份）具有两个或两个以上可进行光聚合的不饱和键合基团的成分 (a) 以外的化合物。