There are provided organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as organic insulating films with low permittivity, high heat resistance and high mechanical strength that employ the same, and semiconductor devices comprising the foregoing. An organic insulating material comprising a compound represented by general formula (1), or a polymer obtained by polymerizing a compound represented by general formula (1), or a mixture of a compound represented by general formula (1) and the polymer.
X-VW
n
Y (1)
(In formula (1), X and Y each independently represent one or more groups with polymerizable functional groups. V and W each represent a group having an adamantane or polyamantane structure, and they may be the same or different. The letter n represents an integer of 0 or greater).
提供了有机绝缘材料,具有低介电常数、高耐热性和高机械强度,以及采用相同材料的低介电常数、高耐热性和高机械强度的有机绝缘膜,以及包括上述材料的半导体器件。有机绝缘材料包括由通式(1)表示的化合物、由通式(1)表示的化合物聚合得到的聚合物,或通式(1)表示的化合物和聚合物的混合物。X和Y各自独立表示具有可聚合功能基团的一个或多个基团。V和W分别表示具有
金刚烷或聚
金刚烷结构的基团,它们可以相同也可以不同。字母n表示大于等于0的整数。