1,5-dimethyl-5-phenyl-pyrimidine-2,4,6-trione | 4336-84-9

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 二嗪类
• 英文名称: 1,5-dimethyl-5-phenyl-pyrimidine-2,4,6-trione
• 英文别名: 1,5-dimethyl-5-phenyl-barbituric acid；1,5-Dimethyl-5-phenyl-barbitursaeure；1,5-Dimethyl-5-phenyl-1,3-diazinane-2,4,6-trione
• CAS: 4336-84-9
• 化学式: C₁₂H₁₂N₂O₃
• 分子量: 232.239
• InChiKey: VTIMKWYUDLSVRN-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.5
• 重原子数：
  17
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  66.5
• 氢给体数：
  1
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  甲基苯基丙二酸二乙酯 、 N-甲基脲 生成 1,5-dimethyl-5-phenyl-pyrimidine-2,4,6-trione
  参考文献：
  名称：

  DE537366

  摘要：

  公开号：

文献信息

• Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films
  申请人：BASF SE

  公开号：EP2428541A1

  公开（公告）日：2012-03-14

  An aqueous polishing composition has been found, the said aqueous polishing composition comprising (A) at least one type of abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and having a pH in the range of from 3 to 9 as evidenced by the electrophoretic mobility; (B) at least one water-soluble polymer selected from the group consisting of linear and branched alkylene oxide homopolymers and copolymers; and (C) at least one anionic phosphate dispersing agent; and a process for polishing substrate materials for electrical, mechanical and optical devices making use of the aqueous polishing composition.

  发现了一种水性抛光组合物，所述水性抛光组合物包括 (A) 至少一种磨料颗粒，分散在不含组分（B）的水介质中时带正电，从电泳迁移率看，其 pH 值在 3 至 9 之间； (B) 至少一种水溶性聚合物，选自由线性和支链环氧亚烷基均聚物和共聚物组成的 组；以及 (C) 至少一种阴离子磷酸盐分散剂； 以及一种利用该水性抛光组合物对电气、机械和光学设备的基底材料进行抛光的工艺。
• Method of polishing a silicon-containing dielectric
  申请人：Cabot Microelectronics Corporation

  公开号：US20040152309A1

  公开（公告）日：2004-08-05

  The invention is directed to a method of polishing a silicon-containing dielectric layer involving the use of a chemical-mechanical polishing system comprising (a) an inorganic abrasive, (b) a polishing additive, and (c) a liquid carrier, wherein the polishing composition has a pH of about 4 to about 6. The polishing additive comprises a functional group having a pK a of about 4 to about 9 and is selected from the group consisting of arylamines, aminoalcohols, aliphatic amines, heterocyclic amines, hydroxamic acids, aminocarboxylic acids, cyclic monocarboxylic acids, unsaturated monocarboxylic acids, substituted phenols, sulfonamides, thiols, salts thereof, and combinations thereof. The invention is further directed to the chemical-mechanical polishing system, wherein the inorganic abrasive is ceria.

  本发明涉及一种对含硅介电层进行抛光的方法，该方法涉及使用一种化学机械抛光系统，该系统包括(a)一种无机磨料、(b)一种抛光添加剂和(c)一种液体载体，其中抛光组合物的 pH 值约为 4 至 6。 a 为约 4 至约 9 的官能团，该官能团选自由芳胺、氨基醇、脂肪胺、杂环胺、羟肟酸、氨基羧酸、环状单羧酸、不饱和单羧酸、取代酚、磺酰胺、硫醇、其盐及其组合组成的组。本发明还涉及化学机械抛光系统，其中无机磨料为铈。
• Readily deinkable toners
  申请人：Carter W. Phillip

  公开号：US20060196848A1

  公开（公告）日：2006-09-07

  The invention is directed to a method of polishing a silicon-containing dielectric layer involving the use of a chemical-mechanical polishing system comprising (a) an inorganic abrasive, (b) a polishing additive, and (c) a liquid carrier, wherein the polishing composition has a pH of about 4 to about 6. The polishing additive comprises a functional group having a pK a of about 3 to about 9 and is selected from the group consisting of arylamines, aminoalcohols, aliphatic amines, heterocyclic amines, hydroxamic acids, aminocarboxylic acids, cyclic monocarboxylic acids, unsaturated monocarboxylic acids, substituted phenols, sulfonamides, thiols, salts thereof, and combinations thereof. The invention is further directed to the chemical-mechanical polishing system, wherein the inorganic abrasive is ceria.

  本发明涉及一种对含硅介电层进行抛光的方法，该方法涉及使用一种化学机械抛光系统，该系统包括(a)一种无机磨料、(b)一种抛光添加剂和(c)一种液体载体，其中抛光组合物的 pH 值约为 4 至 6。 a 为约 3 至约 9 的官能团，该官能团选自由芳胺、氨基醇、脂肪胺、杂环胺、羟肟酸、氨基羧酸、环状单羧酸、不饱和单羧酸、取代酚、磺酰胺、硫醇、其盐及其组合组成的组。本发明还涉及化学机械抛光系统，其中无机磨料为铈。
• DE590175
  申请人：——

  公开号：——

  公开（公告）日：——
• US2061114
  申请人：——

  公开号：——

  公开（公告）日：——