申请人:Nippon Kayaku Kabushiki Kaisha
公开号:EP1548043A1
公开(公告)日:2005-06-29
The present invention relates to an epoxy resin composition for sealing photosemiconductor, the epoxy resin composition containing
(A) a bisphenol-type epoxy resin represented by the following formula (1)
(in the formula, R1s represent hydrogen atom, a C1 - C8 alkyl group, a halogen atom; R2s represent hydrogen atom, a C1 - C5 alkyl group, a halogen-substituted (C1 - C5) alkyl group or phenyl group; n represents an integer), where the ratio of the total content of such bisphenol-type lower molecular epoxy resins with n = 0, 1 or 2 is 10% by weight or more of the whole resin;
(B) a terpene backbone-containing polyvalent phenol curing agent prepared by adding two molecules of phenols to one molecule of a cyclic terpene compound;
(C) a curing-promoting agent;
(D) at least one resin selected from the group consisting of epoxy resins except for the component (A) and novolak resins as a curing agent;
and an photosemiconductor device sealed with the cured material of the composition, where the composition has great workability and good productivity of sealed photosemiconductor, so that the resulting photosemiconductor sealed with the cured material of the composition has great solder reflowresistance after moisture absorption and good thermal resistance for HC.
本发明涉及一种用于密封光半导体的环氧树脂组合物,该环氧树脂组合物包含
(A) 由下式(1)表示的双酚型环氧树脂
(式中,R1s 代表氢原子、C1-C8 烷基、卤素原子;R2s 代表氢原子、C1-C5 烷基、卤素取代的(C1-C5)烷基或苯基;n 代表整数),其中,n=0、1 或 2 的双酚型低分子环氧树脂的总含量占整个树脂重量的比例为 10%或以上;
(B) 一种含萜烯骨架的多价酚固化剂,其制备方法是在一分子环状萜烯化合物中 加入两分子酚,其中一分子酚的重量比为 10%或以上;
(C) 一种固化促进剂;
(D) 至少一种选自环氧树脂(成分(A)除外)和酚醛树脂组成的组的树脂作为固化剂;
以及用该组合物的固化材料密封的光电半导体器件,其中该组合物具有极佳的可加工性和密封光电半导体的良好生产率,因此用该组合物的固化材料密封的光电半导体在吸湿后具有极佳的耐回流焊性和良好的耐热性。