RESIN COMPOSITION FOR PRINTED-CIRCUIT BOARD, PREPREG, METAL FOIL-CLAD LAMINATE BOARD, RESIN COMPOSITE SHEET, AND PRINTED-CIRCUIT BOARD
申请人:Mitsubishi Gas Chemical Company, Inc.
公开号:EP3103825A1
公开(公告)日:2016-12-14
A resin composition for a printed wiring board comprising:
a cyanate compound (A) represented by the following general formula (1); and
an epoxy resin (B),
wherein Ar1 represents an aryl group, Ar2 each independently represents a divalent substituent selected from the group consisting of a phenylene group, a naphthylene group, and a biphenylene group, Ar3 each independently represents a p+1-valent substituent selected from the group consisting of a p+1-valent phenyl group, a p+1-valent naphthyl group, and a p+1-valent biphenyl group, R1 each independently represents a monovalent substituent selected from the group consisting of a hydrogen atom, an alkyl group, and an aryl group, R2 each independently represents a monovalent substituent selected from the group consisting of a hydrogen atom, an alkyl group, an aryl group, and a cyanato group, n represents number of cyanato groups bonded to Ar1 and is an integer of 1 to 3, m represents number of R1 bonded to Ar1, n + m + 2 is equal to or less than number of possible bonds to Ar1, p represents number of R2 bonded to Ar3 and is an integer of 1 to 9, x and y represent a ratio of repeating units, x is 1, whereas y is 0.25 to 2.0, and the repeating units for x and y may each be continuously arranged or may be alternately or randomly arranged with each other.
一种用于印刷线路板的树脂组合物,包括
由以下通式(1)表示的氰酸酯化合物(A);以及
环氧树脂 (B)、
其中 Ar1 代表芳基;Ar2 各自独立地代表选自由亚苯基、亚萘基和联苯基组成的组中的二价取代基;Ar3 各自独立地代表选自由 p+1 价苯基、p+1 价亚萘基和 p+1 价联苯基组成的组中的 p+1 价取代基;R1 各自独立地代表选自由氢原子、烷基和芳基组成的组中的一价取代基;R2 各自独立地代表选自由氢原子、烷基和芳基组成的组中的一价取代基、R2 各自独立地代表选自由氢原子、烷基、芳基和氰基组成的组的一价取代基,n 代表与 Ar1 键合的氰基的数目,且为 1 至 3 的整数、m 代表与 Ar1 键合的 R1 的数目,n + m + 2 等于或小于与 Ar1 可能键合的数目,p 代表与 Ar3 键合的 R2 的数目,为 1 至 9 的整数,x 和 y 代表重复单元的比率,x 为 1,而 y 为 0。25 至 2.0,x 和 y 的重复单元可以是连续排列的,也可以是相互交替或随机排列的。