20(hydroxymethyl)-7-methoxynaphthalene | 5665-20-3

• 分子结构分类: 有机化合物 - 苯类化合物 - 萘
• 英文名称: 20(hydroxymethyl)-7-methoxynaphthalene
• 英文别名: 7-Methoxy-2-naphthylmethanol；(7-methoxynaphthalen-2-yl)methanol；2-Naphthalenemethanol, 7-methoxy-
• CAS: 5665-20-3
• 化学式: C₁₂H₁₂O₂
• 分子量: 188.226
• InChiKey: TXZRHHVGMGJQJK-UHFFFAOYSA-N

物化性质

• 熔点：
  112-114 °C(Solv: benzene (71-43-2); hexane (110-54-3))
• 沸点：
  358.8±17.0 °C(Predicted)
• 密度：
  1.166±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  2.3
• 重原子数：
  14
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.17
• 拓扑面积：
  29.5
• 氢给体数：
  1
• 氢受体数：
  2

安全信息

• 危险性防范说明：
  P261,P264,P270,P271,P280,P301+P312,P302+P352,P304+P340,P305+P351+P338,P330,P332+P313,P337+P313,P362,P403+P233,P405,P501
• 危险性描述：
  H302,H315,H319,H335

反应信息

• 作为反应物：
  描述：

  20(hydroxymethyl)-7-methoxynaphthalene 在 sodium hydroxide 、 氢氟酸 、 sodium ethanolate 、 三溴化磷 作用下， 反应 205.75h， 生成 8-methoxy-2,3-dihydro-1H-cyclopenta[a]naphthalen-1-one
  参考文献：
  名称：

  新的环戊[a]萘衍生物。合成2-（氨基甲酰基甲基）-8-羟基-3H-环戊[a]萘作为可能的脱氧核糖核酸粘合剂。

  摘要：

  通过在乙酸钠存在下用草酸二乙酯处理，将8-甲氧基-1-氧代-2,3-二氢-1H-环戊[a]萘（4）转化为草酰衍生物（7）。将钠盐形式的化合物7用溴乙酸乙酯在DMF中烷基化为2-（碳乙氧基甲基）-8-甲氧基-1-氧代-2,3-二氢-1H-环戊[a]萘（8）。用甲醇氨处理8，得到相应的酰胺（9）。8用48％HBr脱烷基并随后酯化，得到化合物10。10的氨解反应生成酰胺11，在还原并随后将还原的产物脱水后，得到所需的化合物2-（氨基甲酰基甲基）-8-羟基-3H-环戊[a]萘（2）。发现化合物2对培养物中的L1210和CCRF-CEM白血病细胞具有轻度生长抑制作用。根据热转变温度研究，

  DOI：

  10.1021/jm00179a008
• 作为产物：
  描述：

  7-methoxy-2-naphthaldehyde 在 甲醇 、 sodium tetrahydroborate 作用下， 反应 4.0h， 以97%的产率得到20(hydroxymethyl)-7-methoxynaphthalene
  参考文献：
  名称：

  使用π扩展亲电试剂的无环酯的对映选择性α-苄基化

  摘要：

  报道了无环酯的第一次不对称协作路易斯碱/钯催化的苄基烷基化。该反应通过立体定义的C1-烯醇铵盐亲核试剂进行。成功的关键是鉴定具有独特反应性的磷酸苄基亲电试剂。获得的烷基化产物具有很高的对映选择性，该方法已应用于凝血酶抑制剂DX‐9065a的合成。

  DOI：

  10.1002/anie.201806742

文献信息

• Modified phenolic resin, method for producing modified phenolic resin, modified epoxy resin, method for producing modified epoxy resin, curable resin composition, cured product of same, and printed wiring board
  申请人：DIC Corporation

  公开号：US10017604B2

  公开（公告）日：2018-07-10

  Provided are a modified epoxy resin and a modified epoxy resin whose cured products exhibit good heat resistance and dielectric properties, methods for producing these, a curable resin composition, a cured product of the curable resin composition, and a printed wiring substrate. A modified phenolic resin comprises a phenolic resin structure (A), wherein at least one aromatic nucleus (a) in the phenolic resin structure (A) has, as a substituent, a structural segment (1) represented by structural formula (1) below: In the formula, Ar each independently represent a phenyl group, a naphthyl group, or a structural segment having, on an aromatic nucleus of a phenyl or naphthyl group, at least one substituent selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, a halogen atom, a phenyl group, and an aralkyl group.

  本发明提供了一种改性环氧树脂和一种改性环氧树脂（其固化物具有良好的耐热性和介电性能）、生产方法、可固化树脂组合物、可固化树脂组合物的固化物以及印刷线路基板。改性酚醛树脂包括酚醛树脂结构（A），其中酚醛树脂结构（A）中的至少一个芳香族核（a）具有如下结构式（1）表示的结构段（1）作为取代基： 式中，Ar 分别独立地代表苯基、萘基，或在苯基或萘基的芳香核上具有至少一个取代基的结构段，该取代基可从具有 1 至 4 个碳原子的烷基、具有 1 至 4 个碳原子的烷氧基、卤素原子、苯基和芳烷基组成的组中选出。
• Antihyperglycemic activity of novel naphthalenylmethyl-3H-1,2,3,5-oxathiadiazole 2-oxides
  作者：John W. Ellingboe、Louis J. Lombardo、Thomas R. Alessi、Thomas T. Nguyen、Frieda Guzzo、Charles J. Guinosso、James Bullington、Eric N. C. Browne、Jehan F. Bagli

  DOI：10.1021/jm00069a006

  日期：1993.8

  A series of naphthalenyl 3H-1,2,3,5-oxathiadiazole 2-oxides was prepared and tested for antihyperglycemic activity in the db/db mouse, a model for type 2 (non-insulin dependent) diabetes mellitus. Substitution at the 1-, 5-, or 8-positions of the naphthalene ring with a halogen was found to be beneficial to antihyperglycemic activity. 4-[(5-Chloronaphthalen-2-yl)methyl]-3H-1,2,3,5-oxathiadiazole 2-oxide (45), one of the most potent compounds in this series, was selected for further pharmacological evaluation.
• Mukerjee, Y. N.; Gaur, S. P.; Jain, P. C., Indian Journal of Chemistry - Section B Organic and Medicinal Chemistry, 1985, vol. 24, p. 985 - 987
  作者：Mukerjee, Y. N.、Gaur, S. P.、Jain, P. C.、Anand, Nitya

  DOI：——

  日期：——
• MUKERJEE Y. N.; GAUR S. P.; JAIN P. C. (LATE); ANAND NITYA, INDIAN J. CHEM., 24,(1985) N 9, 985-987
  作者：MUKERJEE Y. N.、 GAUR S. P.、 JAIN P. C. (LATE)、 ANAND NITYA

  DOI：——

  日期：——
• CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PHENOL RESIN, EPOXY RESIN, AND SEMICONDUCTOR ENCAPSULATING MATERIAL
  申请人：Ogura Ichirou

  公开号：US20130184377A1

  公开（公告）日：2013-07-18

  The present invention provides a heat-curable resin composition having excellent fluidity and realizing moisture-resistance reliability suitable for recent electronic component-related materials and high flame retardancy in a halogen-free state for harmony with the environment, a cured product thereof, a semiconductor encapsulating material using the composition, and a phenol resin and epoxy resin which give these performances. The heat-curable resin composition includes, as essential components, an epoxy resin (A) and a phenol resin (B), the phenol resin (B) having a phenol resin structure having, as a basic skeleton, a structure in which a plurality of phenolic hydroxyl group-containing aromatic skeletons (ph) are bonded to each other through an alkylidene group or a methylene group having an aromatic hydrocarbon structure, and an aromatic nucleus of the phenol resin structure has a naphthylmethyl group or an anthrylmethyl group.