bis-(4-phenoxy-phenyl)-methane | 10125-19-6

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: bis-(4-phenoxy-phenyl)-methane
• 英文别名: Bis-(4-phenoxy-phenyl)-methan；Bis-(p-phenoxy-phenyl)-methan；p,p'-Diphenoxy-diphenylmethan；4,4'-Diphenoxydiphenylmethan；1-Phenoxy-4-[(4-phenoxyphenyl)methyl]benzene
• CAS: 10125-19-6
• 化学式: C₂₅H₂₀O₂
• 分子量: 352.433
• InChiKey: NJDFPACIRCAMTB-UHFFFAOYSA-N

物化性质

• 熔点：
  67.5 °C
• 沸点：
  482.1±38.0 °C(Predicted)
• 密度：
  1.136±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  6.9
• 重原子数：
  27
• 可旋转键数：
  6
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.04
• 拓扑面积：
  18.5
• 氢给体数：
  0
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  bis-(4-phenoxy-phenyl)-methane 在 chromium(VI) oxide 作用下， 生成 4,4’-二苯氧基苯甲酮
  参考文献：
  名称：

  Matweew et al., 1958, vol. 22, p. 147,151

  摘要：

  DOI：
• 作为产物：
  描述：

  聚合甲醛 、 二苯醚 在 硫酸 作用下， 生成 bis-(4-phenoxy-phenyl)-methane
  参考文献：
  名称：

  Matweew et al., 1956, # 21, p. 83,89

  摘要：

  DOI：

文献信息

• A Fenton Approach to Aromatic Radical Cations and Diarylmethane Synthesis
  作者：Robert Crowley III、Berkley Lujan、Alex Martinez、Roni Manasi、Justin D. DeBow、Kevin G. M. Kou

  DOI：10.1021/acs.joc.3c01505

  日期：2023.11.3

  carbon-centered radicals to add to electron-deficient systems is a well-precedented process. By coupling the Fe(II)-mediated Fenton reaction with the Fe(III)-mediated single-electron oxidation of anisolic compounds, we demonstrate how electron-rich carbon-centered radicals can react with electron-rich arenes through a radical-polar cascade pathway. This bioinspired approach produces diarylmethane derivatives from

  操纵以碳为中心的自由基以添加到缺电子系统中是一个有先例的过程。通过将 Fe(II) 介导的芬顿反应与 Fe(III) 介导的茴香醇化合物的单电子氧化耦合，我们证明了富电子碳中心自由基如何通过自由基-极性级联与富电子芳烃反应途径。这种仿生方法从简单的未官能化前体生产二芳基甲烷衍生物。
• Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives
  申请人：Musa M. Osama

  公开号：US20070049665A1

  公开（公告）日：2007-03-01

  Die attach adhesive compositions comprise a quinolinol or a quinolinol derivative as an adhesion promoter. An exemplary quinolinol derivative has the structure:
• Curable materials containing siloxane
  申请人：Musa M. Osama

  公开号：US20070212556A1

  公开（公告）日：2007-09-13

  A polymer is prepared from monomers containing at least one carbon to carbon double bond and at least one siloxane moiety and from monomers containing at least one carbon to carbon double bond and at least one moiety that imparts reactivity to the resulting polymer. Siloxane moieties impart permeability; reactivity is obtained from monomers containing epoxy, oxetane, oxazoline, benzoxazine, or episulfide functionality. Additional properties can be added to the polymer by the inclusion in the initial polymerization mix of monomers that impart low glass transition temperature, high glass transition temperature, and adhesion. The level of each functionality can be controlled by the practitioner by varying the amount of monomer containing that functionality added to the initial polymerization. These materials can be B-staged.
• POLYMER HAVING OXOCARBON GROUP, AND USE THEREOF
  申请人：Yoshimura Ken

  公开号：US20070218335A1

  公开（公告）日：2007-09-20

  Disclosed is a polymer having an oxocarbon group represented by the general formula (1). This polymer having an oxocarbon group is useful as a polymer electrolyte as the material for proton conductive membranes in solid polymer fuel cells which use a gas fuel such as a hydrogen gas or a liquid fuel such as methanol or dimethyl ether.
• RESIN COMPOSITION EXCELLENT IN HEAT RESISTANCE AND ADHESIVENESS, AND METHOD FOR PRODUCING SAME
  申请人：Okamoto Syuji

  公开号：US20090018277A1

  公开（公告）日：2009-01-15

  Disclosed is a resin composition composed of a heat-treated resin component (A) obtained by heating and mixing an aromatic imide resin or an aromatic imidazole resin with a carboxylic acid anhydride, and a silane compound (B) having at least one functional group selected from the group consisting of an epoxy group, an amino group, an amide group, a methoxy group, an isocyanate group, a carboxyl group, a mercapto group, a vinyl group, a (poly)sulfide group and a methacrylo group. This resin composition has excellent heat resistance of aromatic imide resins and aromatic imidazole resins while being remarkably improved in adhesion to various bases.