Technetium complexes with thioether ligands—I. Cationic technetium(III) complexes containing tetradentate thioether/monothiole ligands; X-ray structure analysis of bis(benzenethiolato)(5,8,11,14-tetrathiaoctadecane)technetium(III)hexafluorophosphate
摘要:
Cationic technetium(III) complexes containing both tetradentate thioether and monothioles, [Tc(''S4'')(SR)2]PF6 (''S4'': 3,6,9,12-tetrathiatetradecane, 5,8,11,14-tetrathiaoctadecane; SR : monodentate thiolates), were prepared starting from TcO4- and characterized by elemental analysis and spectroscopic methods. Bis(benzenethiolato)(5,8,11,14-tetrathiaoctadecane)technetium(III)hexafluorophosphate was characterized by single-crystal X-ray structural analysis (R = 0.084). In the complex the technetium is centred in a heavily distorted octahedron. The benzenethiolate ligands are coordinated in the cis-configuration.
Resin composition for laser engraving, image forming material, relief printing plate precursor for laser engraving. relief printing plate, and method of producing relief printing plate
申请人:FUJIFILM Corporation
公开号:EP2145765A1
公开(公告)日:2010-01-20
A resin composition for laser engraving, including: a binder polymer; and a metal compound containing a metal selected from the group consisting of metals in Group 1 to Group 15 in the periodic table.
Myokardgängige Technetium-Komplexverbindungen und Verfahren zu deren Herstellung
申请人:Forschungszentrum Rossendorf e.V.
公开号:EP0439871B1
公开(公告)日:1995-05-31
RESIN COMPOSITION FOR LASER ENGRAVING, IMAGE FORMING MATERIAL, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF MANUFACTURING RELIEF PRINTING PLATE
申请人:KAWASHIMA Takashi
公开号:US20090246469A1
公开(公告)日:2009-10-01
The invention provides a resin composition for laser engraving, containing at least (A) a polymerizable compound having two or more ethylenic unsaturated bonds, a carbon-sulfur bond being contained at the site where two among the two or more ethylenic unsaturated bonds are connected and (B) a binder polymer. The invention further provides an image forming material containing the resin composition, a relief printing plate precursor having a relief forming layer which contains the resin composition, a relief printing plate precursor having a relief forming layer which contains a product formed by subjecting the resin composition to cross-linking, a method for manufacturing a relief printing plate including subjecting the relief printing plate precursor having the relief forming layer which contains the resin composition to cross-linking, and a relief printing plate manufactured by the manufacturing method.
RESIN COMPOSITION FOR LASER ENGRAVING, IMAGE FORMING MATERIAL, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD OF PRODUCING RELIEF PRINTING PLATE
申请人:KAWASHIMA Takashi
公开号:US20100015416A1
公开(公告)日:2010-01-21
A resin composition for laser engraving, including: a binder polymer; and a metal compound containing a metal selected from the group consisting of metals in Group 1 to Group 15 in the periodic table.