2,2'-di-(p-aminophenoxy)-biphenyl | 65801-73-2

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 2,2'-di-(p-aminophenoxy)-biphenyl
• 英文别名: 2,2'-bis(4-aminophenyloxy)biphenyl；2,2'-bis(4-aminophenoxy)biphenyl；4,4'-([1,1'-Biphenyl]-2,2'-diylbis(oxy))dianiline；4-[2-[2-(4-aminophenoxy)phenyl]phenoxy]aniline
• CAS: 65801-73-2
• 化学式: C₂₄H₂₀N₂O₂
• 分子量: 368.435
• InChiKey: GAXOPMJVJBPXRN-UHFFFAOYSA-N

物化性质

• 熔点：
  158-160 °C
• 沸点：
  559.4±50.0 °C(Predicted)
• 密度：
  1.226±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  5.2
• 重原子数：
  28
• 可旋转键数：
  5
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  70.5
• 氢给体数：
  2
• 氢受体数：
  4

安全信息

• 海关编码：
  2922299090

反应信息

• 作为反应物：
  描述：

  2,2'-di-(p-aminophenoxy)-biphenyl 生成 2,2’-双(4-硝基苯氧基)联苯
  参考文献：
  名称：

  Aromatic diamines and their use as polycondensation components for the

  摘要：

  本文描述了新型多核芳香胺类化合物，例如2,2'-二-(对氨基苯氧基)-联苯，以及它们的制备方法和它们作为聚合物合成组分用于制造聚酰胺、聚酰胺酰亚胺和聚酰亚胺聚合物的用途。根据本发明使用芳香胺制备的聚合物易于溶解并且可以从熔融态加工，具有良好的热性能、电性能和/或机械性能。

  公开号：

  US04196144A1
• 作为产物：
  描述：

  2,2’-双(4-硝基苯氧基)联苯 生成 2,2'-di-(p-aminophenoxy)-biphenyl
  参考文献：
  名称：

  MILTO, V. I.;MIRONOV, G. S.;KOPEJKIN, V. V., IZV. VUZOV. XIMIYA I XIM. TEXNOL., 33,(1989) N, S. 28-32

  摘要：

  DOI：

文献信息

• NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20190169211A1

  公开（公告）日：2019-06-06

  The present invention has been made in view of the circumstances herein. An object of the present invention is to provide: a tetracarboxylic dianhydride which can lead to a polyimide usable as a base resin of a photosensitive resin composition capable of forming a fine pattern and obtaining high resolution without impairing excellent characteristics such as mechanical strength and adhesiveness; a polyimide resin obtained by using the tetracarboxylic dianhydride; and a method for producing the polyimide resin. The tetracarboxylic dianhydride is shown by the following general formula (1).

  本发明是基于本文中的情况而作出的。本发明的目的是提供：一种四羧酸二酐，可导致聚酰亚胺，作为感光树脂组合物的基树脂，能够形成细微图案并获得高分辨率，同时不损害优异的特性，如机械强度和粘附性；通过使用该四羧酸二酐获得的聚酰亚胺树脂；以及生产该聚酰亚胺树脂的方法。该四羧酸二酐由以下通用式（1）所示。
• Space environmentally durable polyimides and copolyimides
  申请人：——

  公开号：US20030045670A1

  公开（公告）日：2003-03-06

  Polyimides displaying low color in thin films, atomic oxygen resistance, vacuum ultraviolet radiation resistance, solubility in organic solvents in the imide form, high glass transistion (T g ) temperatures, and high thermal stability are provided. The poly(amide acid)s, copoly(amide acid)s, polyimides and copolyimides are prepared by the reaction of stoichiometric ratios of an aromatic dianhydride with diamines which contain phenylphosphine oxide groups in polar aprotic solvents. Controlled molecular weight oligomeric (amide acid)s and imides can be prepared by offsetting the stoichiometry according to the Carothers equation using excess diamine and endcapping with aromatic anhydrides The polyimide materials can be processed into various material forms such as thin films, fibers, foams, threads, adhesive film, coatings, dry powders, and fiber coated prepreg, and uses include thin film membranes on antennas, second-surface mirrors, thermal optical coatings, and multi-layer thermal insulation (MLI) blanket materials.

  提供低颜色的聚酰亚胺薄膜，抗原子氧、真空紫外辐射、有机溶剂溶解性的聚酰亚胺，具有高玻璃转变温度（Tg）和高热稳定性。通过在极性非质子溶剂中的芳香族二酐和含有苯基膦氧基团的二胺的摩尔比反应制备聚酰亚胺和共聚酰亚胺。可以通过根据卡罗瑟方程调整摩尔比，使用过量二胺并用芳香族酐进行端基处理，制备控制分子量寡聚物（酰亚胺）和亚酰亚胺。聚酰亚胺材料可加工成各种形式的材料，如薄膜、纤维、泡沫、线、胶粘膜、涂料、干粉和涂覆纤维的预浸料，用途包括天线上的薄膜膜、第二表面镜、热光学涂层和多层热隔热毯材料。
• NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT
  申请人：International Business Machines Corporation

  公开号：US20210317270A1

  公开（公告）日：2021-10-14

  Provided is a compound that can be used as a base resin for a photosensitive resin composition. The photosensitive resin can form a fine pattern and can achieve high resolution without impairing mechanical strength and solubility. The compound is represented by the general formula (1): wherein Z represents a linear, branched or cyclic divalent hydrocarbon group having 2 to 30 carbon atoms; X 1 to X 3 represent any of —CO 2 —, —CONR X1 —, —O—, —NR X1 —, —S—, —SO 2 —, —SO 3 — and —SO 2 NR X1 — and may be the same as or different from each other, provided that R X1 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms; Ar represents a divalent aromatic group having 2 to 30 carbon atoms; L 1 and L 2 independently represent a divalent hydrocarbon group having 1 to 30 carbon atoms; and x and y are each independently 0 or 1.

  提供的是一种可以用作光敏树脂组合物的基树脂的化合物。这种光敏树脂可以形成精细图案，并且可以在不影响机械强度和溶解性的情况下实现高分辨率。该化合物由通式（1）表示：其中Z代表具有2到30个碳原子的线性、支链或环状二价碳氢基团；X1到X3代表任何一种—CO2—、—CONRX1—、—O—、—NRX1—、—S—、—SO2—、—SO3—和—SO2NRX1—中的一种，并且它们可以相同也可以不同，只要RX1是氢原子或具有1到30个碳原子的一价碳氢基团；Ar代表具有2到30个碳原子的二价芳香基团；L1和L2分别代表具有1到30个碳原子的二价碳氢基团；x和y分别独立地为0或1。
• TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYMER OF POLYIMIDE PRECURSOR AND METHOD FOR PRODUCING SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20180120702A1

  公开（公告）日：2018-05-03

  The present invention provides a tetracarboxylic acid diester compound represented by the following general formula (1), wherein, X 1 represents a tetravalent organic group, and R 1 represents a group represented by the following general formula (2), wherein, the dotted line represents a bonding, Y 1 represents an organic group with a valency of k+1, Rs represents a group containing at least one silicon atom, “k” represents 1, 2 or 3, and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound which can lead a polymer of a polyimide precursor capable of using a base resin of a negative photosensitive resin composition which is capable of forming a fine pattern and giving high resolution, a polymer of a polyimide precursor obtained by using the tetracarboxylic acid diester compound and a method for producing the same.

  本发明提供了一种四羧酸二酯化合物，其表示为以下通式（1）：其中，X1表示四价有机基团，R1表示以下通式（2）所表示的基团：其中，虚线表示键合，Y1表示具有k+1价的有机基团，Rs表示含有至少一个硅原子的基团，“k”表示1、2或3，“n”表示0或1。可以提供一种四羧酸二酯化合物，该化合物能够引导聚合物的形成，该聚合物是由使用负光敏树脂组合物的基树脂制成的，该组合物能够形成细微图案并具有高分辨率，使用四羧酸二酯化合物制得的聚酰亚胺前体聚合物以及其制备方法。
• DIAMINE COMPOUND, AND HEAT-RESISTANT RESIN OR HEAT-RESISTANT RESIN PRECURSOR USING SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20170334837A1

  公开（公告）日：2017-11-23

  Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).

  提供了一种具有优异图案加工性（高灵敏度和高分辨率）且在热处理后具有优异化学耐性和热耐性的光敏树脂组合物；用于该组合物的耐热树脂或耐热树脂前体；以及作为树脂和前体原料的二胺化合物。该二胺化合物是由通式（1）表示的二胺化合物。