2,7-Diamino-2,7-dimethyloctan | 17113-46-1

• 分子结构分类: 有机化合物 - 有机氮化合物
• 英文名称: 2,7-Diamino-2,7-dimethyloctan
• 英文别名: 2,7-Dimethyloctane-2,7-diamine
• CAS: 17113-46-1
• 化学式: C₁₀H₂₄N₂
• 分子量: 172.314
• InChiKey: BKERIXDUTUBMHU-UHFFFAOYSA-N

物化性质

• 熔点：
  108-111 °C
• 沸点：
  243.0±8.0 °C(Predicted)
• 密度：
  0.857±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1
• 重原子数：
  12
• 可旋转键数：
  5
• 环数：
  0.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  52
• 氢给体数：
  2
• 氢受体数：
  2

反应信息

• 作为产物：
  描述：

  2,7-二甲基辛烷 在 硝酸 、 溶剂黄146 、 锌 作用下， 生成 2,7-Diamino-2,7-dimethyloctan
  参考文献：
  名称：

  Konowalow, Chemische Berichte, 1896, vol. 29, p. 2200

  摘要：

  DOI：

文献信息

• Butadiene sulphone chemistry. Part III. Condensation reactions of butadiene sulphone
  作者：C. S. Argyle、K. G. Mason、M. A. Smith、E. S. Stern

  DOI：10.1039/j39670002176

  日期：——

  2,5-Dihydrothiophen dioxide reacts with aliphatic ketones to give di-condensation products [e.g., (II)] and monosubstitution products [e.g., (III) and (IV)] with a carbinol group either at the 5- or at the 4-position. The structures are confirmed by physical means and independent syntheses of the hydrogenated carbinols. From aromatic aldehydes the di-condensation products only are obtained. Acrylonitrile

  2,5-二氢噻吩二氧化物与脂肪族酮反应，生成在5或4处带有甲醇基团的二缩合产物[例如（II）]和单取代产物[例如（III）和（IV）]。 -位置。通过物理手段和氢化甲醇的独立合成证实了结构。从芳族醛仅获得缩合产物。丙烯腈与2,5-二氢噻吩二氧化物反应生成四氰基乙基化产物（V），该产物容易消除二氧化硫而生成二烯（VI）。通过与肼水溶液加热从（II）中除去二氧化硫的新方法得到了带有二硫化氢的二肼基二烯（VII）。
• Flexible multi-layer polyimide film laminates and preparation thereof
  申请人：E.I. DU PONT DE NEMOURS AND COMPANY

  公开号：EP0474054A2

  公开（公告）日：1992-03-11

  Flexible multilayer polyimide metal-clad laminates, and their preparation, having at least one layer of aromatic polyimide bonded to at least one layer of a metallic substrate using a heat-sealable copolyimide adhesive containing repeating imide units derived from 4,4'-oxydiphthalic dianhydride and an aromatic ether diamine. The laminates are used in flexible printed circuits and tape automated bonding applications. Additionally, the metallic substrate may be directly coated with the copolyimide adhesive and used as a single-clad laminate for flexible printed circuits.

  柔性多层聚酰亚胺金属包覆层压板及其制备方法，该层压板至少有一层芳香族聚酰亚胺与至少一层金属基板粘合在一起，使用的是一种可热封的共聚亚胺粘合剂，该粘合剂含有由 4,4'-氧代二酞二酸酐和芳香族醚二胺衍生的重复亚胺单元。这种层压板可用于柔性印刷电路和胶带的自动粘合。此外，金属基板可直接涂覆共聚亚胺粘合剂，并用作柔性印刷电路的单层覆膜。
• Coextruded multi-layer aromatic polyimide film and preparation thereof
  申请人：E.I. DU PONT DE NEMOURS AND COMPANY

  公开号：EP0659553A1

  公开（公告）日：1995-06-28

  A multi-layer polyimide film having excellent adhesion between the layers without using an adhesive, prepared by coextruding a layer of a first poly(amic acid) derived from the reaction of an aromatic tetracarboxylic dianhydride and an aromatic diamine and at least one layer of a second poly(amic acid) derived from the reaction of 4,4'-oxydiphthalic dianhydride and a (diaminophenoxy)benzene to form a self-supporting multi-layer poly(amic acid) film and heat-treating the multi-layer film to completely convert the poly(amic acid) layers to the multi-layer polyimide film. Optionally, the poly(amic acid) solutions may contain fine particles of an inorganic filler to enhance properties of the multi-layer film. The coextruded multi-layer polyimide film is used in the formation of single and double polyimide metal-clad laminates for use in flexible circuit applications.

  一种多层聚酰亚胺薄膜，无需使用粘合剂即可在各层之间形成极佳的粘合力，其制备方法是将一层由芳香族四羧酸二酐和芳香族二胺反应制得的第一层聚(amic acid)和至少一层由 4、4'-oxydiphthalic dianhydride 和 (diaminophenoxy)benzene 反应生成的第二层聚(amic acid)，以形成自支撑多层聚(amic acid)膜，并对多层膜进行热处理，使聚(amic acid)层完全转化为多层聚酰亚胺膜。可选择在聚(胺基酸)溶液中加入无机填料微粒，以增强多层薄膜的性能。共挤多层聚酰亚胺薄膜可用于形成单层和双层聚酰亚胺金属包覆层压板，用于柔性电路应用。
• High dielectric constant flexible polyimide film and process of preparation
  申请人：E.I. DU PONT DE NEMOURS AND COMPANY

  公开号：EP0902048A1

  公开（公告）日：1999-03-17

  A flexible, high dielectric constant polyimide film composed of either a single layer of an adhesive thermoplastic polyimide film or a multilayer polyimide film having adhesive thermoplastic polyimide film layers bonded to one or both sides of the film and having dispersed in at least one of the polyimide layers from 4 to 85 weight % of a ferroelectric ceramic filler, such as barium titanate or polyimide coated barium titanate, and having a dielectric constant of from 4 to 60. The high dielectric constant polyimide film can be used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors.

  一种柔性高介电常数聚酰亚胺薄膜，由单层粘合剂热塑性聚酰亚胺薄膜或多层聚酰亚胺薄膜组成，多层聚酰亚胺薄膜的一面或两面均粘合有粘合剂热塑性聚酰亚胺薄膜层，至少其中一层聚酰亚胺薄膜层中分散有 4 至 85 重量％的铁电陶瓷填料，如钛酸钡或聚酰亚胺涂层钛酸钡，介电常数为 4 至 60。 高介电常数聚酰亚胺薄膜可用于电子电路和电子元件，如多层印刷电路、柔性电路、半导体封装和埋膜电容器。
• OPEN TYPE POLYIMIDE MOLDED PRODUCT AND PRODUCTION METHOD THEREOF
  申请人：DU PONT-TORAY COMPANY, LTD.

  公开号：EP1103366A1

  公开（公告）日：2001-05-30

  An open-ended polyimide molding of an aromatic polyimide resin, which is characterized in that its wall thickness is at most 0.5 mm, and that the ratio of its depth to its opening is at least 0.7, or its longest major axis is at least 150 mm in length with its draw depth being at least 0.5 mm.

  一种由芳香族聚酰亚胺树脂制成的开口聚酰亚胺模塑件，其特征在于其壁厚最多为 0.5 毫米，深度与开口之比至少为 0.7，或者其最长主轴长度至少为 150 毫米，拉伸深度至少为 0.5 毫米。