1-(4-hydroxyphenyl)-3-methylpyrrolidine-2,5-dione | 99843-30-8

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯烷类
• 英文名称: 1-(4-hydroxyphenyl)-3-methylpyrrolidine-2,5-dione
• 英文别名: 1-(4-Hydroxy-phenyl)-3-methyl-pyrrolidin-2,5-dion
• CAS: 99843-30-8
• 化学式: C₁₁H₁₁NO₃
• 分子量: 205.213
• InChiKey: LVWBWWRPJVCIDX-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.9
• 重原子数：
  15
• 可旋转键数：
  1
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.27
• 拓扑面积：
  57.6
• 氢给体数：
  1
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  重氮甲烷 、 1-(4-hydroxyphenyl)-3-methylpyrrolidine-2,5-dione 在 乙醚 、 乙醇 作用下， 生成 N-p-methoxyphenyl-2-methylsuccinimide
  参考文献：
  名称：

  Dane et al., Justus Liebigs Annalen der Chemie, 1957, vol. 607, p. 92,101

  摘要：

  DOI：
• 作为产物：
  描述：

  N-(4-hydroxy-phenyl)-3-methyl-succinomonoimidic acid-1-(4-hydroxy-anilide) 在 硫酸 、 水 作用下， 生成 1-(4-hydroxyphenyl)-3-methylpyrrolidine-2,5-dione
  参考文献：
  名称：

  Dane et al., Justus Liebigs Annalen der Chemie, 1957, vol. 607, p. 92,101

  摘要：

  DOI：

文献信息

• Experimental and theoretical study on the structure-property relationship of novel 1-aryl-3-methylsuccinimides
  作者：Nebojša R. Banjac、Bojan Đ. Božić、Jelena M. Mirković、Vesna D. Vitnik、Željko J. Vitnik、Nataša V. Valentić、Gordana S. Ušćumlić

  DOI：10.1016/j.molstruc.2016.09.086

  日期：2017.2

  the substituents on the UV–Vis absorption and NMR spectra was analyzed using the simple Hammett equation. Moreover, the B3LYP, CAM-B3LYP, and M06-2X functionals using the 6–311G(d,p) basic set have been assessed in light of the position of experimental absorption maxima obtained for these compounds. The integration grid effects have also been evaluated. An interpretation of the substituent-effect transmission

  摘要 合成了一系列 10 种 1-芳基-3-甲基琥珀酰亚胺，并在一组 15 种二元溶剂混合物中研究了它们的溶剂致变色性能。根据 Kamlet 和 Taft 提出的线性溶剂化能关系 (LSER) 概念分析溶质-溶剂相互作用。使用简单的哈米特方程分析取代基对 UV-Vis 吸收和 NMR 光谱的电子效应。此外，根据对这些化​​合物获得的实验吸收最大值的位置，已经评估了使用 6-311G(d,p) 基本组的 B3LYP、CAM-B3LYP 和 M06-2X 泛函。还评估了集成网格效应。给出了通过分子骨架的取代基效应传输以及基于量子化学计算的 HOMO 和 LUMO 轨道的性质的解释。使用 B3LYP、CAM-B3LYP 和 M06-2X 方法生成了来自原子极性张量 (APT)、自然布居分析 (NBO) 和适合静电势的电荷的部分原子电荷值，并与不同的实验性质相关联. 为了估计分子的化学活性，计算了
• Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostion
  申请人：Toray Industries, Inc.

  公开号：US10941320B2

  公开（公告）日：2021-03-09

  The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.

  本发明提供了一种具有优异耐热性的临时粘接剂，据此可通过单一类型的粘接剂层粘接半导体电路形成基板和支撑基板，其粘接力在制造半导体器件或类似物的步骤过程中不会发生变化，并且该粘接剂随后可在室温温和条件下轻松脱粘；以及一种使用该临时粘接剂制造半导体器件的方法。本发明包括一种临时粘合粘合剂，其中聚酰亚胺共聚物至少具有酸二酐残基和二胺残基，二胺残基包括(A1)由通式(1)表示的聚硅氧烷基二胺残基（其中n为1至15的自然数）和(B1)由通式(1)表示的聚硅氧烷基二胺残基（其中n为16至100的自然数）中的两种，聚酰亚胺共聚物含有40-99.99摩尔%的(A1)残余物和0.01-60摩尔%的(B1)残余物。
• Resin composition, resin layer, permanent adhesive, adhesive for temporary bonding, laminated film, processed wafer, and method for manufacturing electronic component or semiconductor device
  申请人：Toray Industries, Inc.

  公开号：US11186757B2

  公开（公告）日：2021-11-30

  A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 μm or more and 100 μm or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.

  一种树脂组合物至少含有 (a) 具有特定结构的聚酰亚胺树脂和 (b) 含有芴基的交联剂。该树脂组合物能够将电子电路形成基板或半导体电路形成基板和支撑基板粘合在一起。该树脂组合物在粘合厚度为 1 μm 或以上、100 μm 或以下的电子电路形成基板或半导体电路形成基板时具有优异的耐热性。该树脂组合物在电子元件、半导体器件等的制造过程中具有稳定的粘合力，并可在制造过程结束后的室温条件下温和剥离。此外，还公开了含有该树脂组合物的粘合剂、树脂层、层压膜和加工晶片，以及使用它们制造电子元件或半导体器件的方法。
• Giuffrida; Chimienti, Gazzetta Chimica Italiana, 1904, vol. 34 II, p. 262
  作者：Giuffrida、Chimienti

  DOI：——

  日期：——
• Nanocomposite Comprising Stabilization Functionalized Thermoplastic Polyolefins
  申请人：Gong Caiguo

  公开号：US20080214707A1

  公开（公告）日：2008-09-04

  This invention relates to nanocomposites comprising organo-clay and at least one stabilization functionalized thermoplastic polyolefin. Preferably the stabilization functionalized thermoplastic polyolefin is represented by the formula: T-(R 1 G) n wherein T represents the thermoplastic polyolefin Each R 1 is a bridging group, preferably independently selected from the group consisting of C 1 to C 20 aliphatic; C 1 to C 20 aromatic; substituted C 1 to C 20 aliphatic; substituted C 1 to C 20 aromatic; C 1 to C 20 aliphatic ester; C 1 to C 20 aliphatic ether; C 1 to C 20 aliphatic amide; C 1 to C 20 aliphatic imide; n is the number of stabilization functional/bridging groups bound to T and may be from 1-300; and G is selected from one or more of phenols, ketones, hindered amines, substituted phenols, substituted ketones, substituted hindered amines, or combinations thereof.