benzene-1,2,4-tricarboxylic acid-1,4-dimethyl ester | 185050-61-7

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: benzene-1,2,4-tricarboxylic acid-1,4-dimethyl ester
• 英文别名: Benzol-1,2,4-tricarbonsaeure-1,4-dimethylester；Trimellitsaeure-dimethylester-(1.4)；1,4-Dicarbomethoxy-3-carboxy benzene；2,5-bis(methoxycarbonyl)benzoic acid
• CAS: 185050-61-7
• 化学式: C₁₁H₁₀O₆
• 分子量: 238.197
• InChiKey: GKKUVAJSHWPSBO-UHFFFAOYSA-N

物化性质

• 沸点：
  414.9±35.0 °C(Predicted)
• 密度：
  1.340±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1
• 重原子数：
  17
• 可旋转键数：
  5
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.18
• 拓扑面积：
  89.9
• 氢给体数：
  1
• 氢受体数：
  6

反应信息

• 作为反应物：
  描述：

  benzene-1,2,4-tricarboxylic acid-1,4-dimethyl ester 在 氯化亚砜 、 硫酸 作用下， 以 甲醇 、 乙醚 为溶剂， 反应 1.5h， 生成 methyl 1,4-dioxoisochromene-6-carboxylate
  参考文献：
  名称：

  Intramolecular acid-catalyzed reactions of o-carbomethoxy-?-diazoacetophenones

  摘要：

  DOI：

  10.1007/bf00962316
• 作为产物：
  描述：

  1,2,4-苯三甲酸 在 盐酸 、 氢氧化钾 、 硫酸 作用下， 生成 benzene-1,2,4-tricarboxylic acid-1,4-dimethyl ester
  参考文献：
  名称：

  Wegscheider; Perndanner; Auspitzer, Monatshefte fur Chemie, 1910, vol. 31, p. 1297

  摘要：

  DOI：

文献信息

• [EN] BENZENE, PYRIDINE, NAPHTALENE OR BENZOPHENONE DERIVATIVES AS INHIBITORS OF SQUALENE SYNTHETASE AND PROTEIN FARNESYLTRANSFERASE<br/>[FR] DERIVES DE BENZENE, PYRIDINE, NAPHTALENE OU BENZOPHENONE UTILISES COMME INHIBITEURS DE LA SQUALENE SYNTHETASE ET DE LA PROTEINE FARNESYLTRANSFERASE
  申请人：ABBOTT LABORATORIES

  公开号：WO1996034851A1

  公开（公告）日：1996-11-07

  (EN) The present invention provides a compound of formula (I), (II), (III) or (IV), processes for the preparation of the compounds of the invention, intermediates useful in these processes, a pharmaceutical composition, and methods of using the compounds of the invention.(FR) La présente invention se rapporte à des composés de la formule (I), (II), (III) ou (IV), aux procédés de préparation de ces composés, aux intermédiaires utilisés dans ces procédés, à une composition pharmaceutique et aux procédés d'utilisation de ces composés.

  该发明提供了公式（I），（II），（III）或（IV）的化合物，制备该发明化合物的方法，这些方法中有用的中间体，制药组合物以及使用该发明化合物的方法。
• Thermoplastic polyamideimide copolymers and method of preparation
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP0017422A1

  公开（公告）日：1980-10-15

  Thermoplastic polyamideimide copolymers are provided which are excellent in both heat stability and melt viscosity characteristics at a temperature of from about 300°C to about 400°C. The copolymers of the invention comprise Units A of the formula in an amount of about 50 mole %, Units B of the formula in an amount of about 15-48 mole % and Units C of the formula in an amount of about 35-2 mole %, wherein Z is a trivalent aromatic group having two of its three carbonyl groups attached to adjacent carbon atoms, a is 0 or 1, b is 0,1,2,3 or 4, R1 is alkyl (C1-4), R2 is selected from alkyl (C1-4), halo and nitro, c is an integer from 1 to 25 and X is chosen from - SO2 -CO- or -C(CH3)2-. The copolymers may be made by reacting diamines containing the Units B and C respectively, e.g. I and II, with trimellitic acid (or another aromatic tribasic carboxylic acid with two carboxyl groups attached to adjacent carbon atoms) in an organic polar solvent using a dehydrating catalyst - or alternatively the diamines may be reacted with the acid anhydride acid chloride using a hydrochloride scavenger, subsequently closing the ring of the polyamide-amic acid thus formed.

  本发明提供的热塑性聚酰胺酰亚胺共聚物在约 300°C 至约 400°C 的温度条件下，热稳定性和熔融粘度特性都非常出色。 本发明的共聚物包含式中的单元 A，其含量约为 50 摩尔%；式中的单元 B，其含量约为 50 摩尔%。 约 50 摩尔%，式中单元 B 含量约为 15-48 摩尔%，以及式中的单元 C 其中 Z 是三价芳香基团，其三个羰基中的两个与相邻碳原子相连；a 是 0 或 1；b 是 0、1、2、3 或 4；R1 是烷基（C1-4）；R2 选自烷基（C1-4）、卤代和硝基；c 是 1 至 25 的整数；X 选自-SO2-CO-或-C(CH3)2-。共聚物的制造方法是：使用脱水催化剂，在有机极性溶剂中，将分别含有单元 B 和单元 C 的二胺（如 I 和 II）与偏苯三酸（或另一种在相邻碳原子上连接有两个羧基的芳香族三元羧酸）反应，或者使用盐酸盐清除剂，将二胺与酸酐酰氯反应，然后封闭由此形成的聚酰胺-氨基甲酸酯环。
• PASTE COMPOSITION, AND PROTECTIVE FILM AND SEMICONDUCTOR DEVICE BOTH OBTAINED WITH THE SAME
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP1114845A1

  公开（公告）日：2001-07-11

  A paste composition which comprises as essential ingredients (A) a thermoplastic resin, (B) an epoxy resin, (C) a coupling agent, (D) a powdery inorganic filler, (E) a powder having rubber elasticity and (F) an organic solvent and which, when applied and dried, gives a coating film having a void content of 3 % by volume or higher and a water vapor permeability as measured at 40°C and 90 %RH of 500 g/m2·24h or less; a protective film which is formed by applying the paste composition to a surface of a semiconductor part and drying it and has a void content of 3 % by volume or higher and a water vapor permeability as measured at 40°C and 90 %RH of 500 g/m2·24h or less; and a semiconductor device having the protective film.

  一种糊状组合物，其基本成分包括：(A) 热塑性树脂；(B) 环氧树脂；(C) 偶联剂；(D) 粉末状无机填料；(E) 具有橡胶弹性的粉末；(F) 有机溶剂；该糊状组合物在涂抹和干燥后可形成一层涂膜，其空隙率为 3% 或更高，在 40°C 和 90%RH 条件下测得的水蒸气透过率为 500 g/m2-24h 或更低；一种保护膜，它是通过在半导体部件表面涂抹浆糊组合物并将其干燥而形成的，其空隙率为 3% 或更高，在 40°C 和 90%RH 条件下测量的水蒸气渗透率为 500 g/m2-24h 或更低；以及一种具有该保护膜的半导体器件。
• Adhesive film, lead frame with adhesive film, and semiconductor device using same
  申请人：Matsuura Hidekazu

  公开号：US20050255278A1

  公开（公告）日：2005-11-17

  The present invention provides an adhesive film that combines low temperature adhesion with favorable wire bonding characteristics. The adhesive film used for bonding a semiconductor element to a target adherend comprises an adhesive layer formed on one surface, or both surfaces, of a heat resistant film, the adhesive layer comprises a resin A and a resin B, a glass transition temperature of the resin A is lower than a glass transition temperature of the resin B, and the adhesive layer has a sea-island structure, in which the resin A forms the sea, and the resin B forms the islands.
• THERMOPLASTIC RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESION FILM, LEAD FRAME, AND SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
  申请人：Tateoka Kiyohide

  公开号：US20090091012A1

  公开（公告）日：2009-04-09

  The object of the present invention is to provide an adhesion film for semiconductor that is capable of bonding a semiconductor chip to a lead frame tightly at an adhesion temperature lower than that of the adhesion film of a traditional polyimide resin without generation of voids and that can also be used for protection of lead frame-exposed area, a thermoplastic resin composition for semiconductor for use in the adhesive agent layer therein, and a lead frame having the adhesive film and a semiconductor device; and, to achieve the object, the present invention provides a thermoplastic resin composition for semiconductor, comprising a thermoplastic resin obtained in reaction of an amine component containing an aromatic diamine mixture (A) containing 1,3-bis(3-aminophenoxy)benzene, 3-(3′-(3″-aminophenoxy)phenyl)amino-1-(3′-(3″-aminophenoxy)phenoxy)benzene and 3,3′-bis(3″-aminophenoxy)diphenylether, and an acid component (C), an adhesion film for semiconductor using the same, a lead frame having the adhesion film and a semiconductor device using the same.